Inventor

CHEUNG CHEE WAH

HK22 patents

⚠️ This page may combine multiple inventors who share the name “CHEUNG CHEE WAH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEUNG CHEE WAH

COMPASS TECH COMPANY LIMITED

Integrated electro-optical flexible circuit board

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Method of direct embedding a lithium ion battery on a flexible printed circuit board

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Formation of fine pitch traces using ultra-thin PAA modified fully additive process

Method of direct embedding a lithium ion battery on a flexible printed circuit board

Integrated electro-optical flexible circuit board

Formation of fine pitch traces using ultra-thin PAA modified fully additive process

Formation of fine pitch traces using ultra-thin PAA modified fully additive process

Patterning of graphene circuits on flexible substrates

Patterning of graphene circuits on flexible substrates

COMPASS TECHNOLOGY CO LTD

Multiple integrated circuit die package with thermal performance

Die-up integrated circuit package with grounded stiffener

Multiple integrated circuit die package with thermal performance

ANALOG DEVICES INC

Electric coil structure

Battery assembly and method of manufacturing the same

COMPASS TECHNOLOGY COMPANY LTD

Gyro MEMS sensor package

COMPASS TECH COMPANY LTD

Gyro MEMS sensor package