P

Inventor

PARK MIN CHEOL

KR168 patents
⚠️ This page may combine multiple inventors who share the name “PARK MIN CHEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

37 patents
US7046500B2May 16, 2006

Laminated ceramic capacitor

SAMSUNG ELECTRO MECH61 citations95
US8351181B1Jan 8, 2013

Chip type laminated capacitor

SAMSUNG ELECTRO MECH35 citations94
US8351180B1Jan 8, 2013

Multilayer ceramic capacitor

SAMSUNG ELECTRO MECH22 citations93
US7630208B2Dec 8, 2009

Multilayer chip capacitor, circuit board apparatus having the capacitor, and circuit board

SAMSUNG ELECTRO MECH22 citations93
US7595973B1Sep 29, 2009

Multilayer chip capacitor and circuit board apparatus having the capacitor

SAMSUNG ELECTRO MECH26 citations93
US7183872B2Feb 27, 2007

Laminated balun transformer

SAMSUNG ELECTRO MECH26 citations93
US7688568B1Mar 30, 2010

Multilayer chip capacitor

SAMSUNG ELECTRO MECH30 citations92
US7092236B2Aug 15, 2006

Multilayer chip capacitor

SAMSUNG ELECTRO MECH36 citations92
US7035079B1Apr 25, 2006

Multilayered chip capacitor and multilayer chip capacitor array

SAMSUNG ELECTRO MECH34 citations92
US6940710B1Sep 6, 2005

Multilayered chip capacitor

SAMSUNG ELECTRO MECH52 citations92
US10347421B2Jul 9, 2019

Multilayer ceramic electronic component and method of manufacturing the same

SAMSUNG ELECTRO MECH8 citations84
US10236126B2Mar 19, 2019

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH4 citations84
US9984828B2May 29, 2018

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH5 citations84
US9893703B2Feb 13, 2018

Multilayer electronic component

SAMSUNG ELECTRO MECH8 citations84
US9843299B2Dec 12, 2017

Multilayer electronic component

SAMSUNG ELECTRO MECH8 citations84
US9793053B2Oct 17, 2017

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH5 citations84
US9478334B2Oct 25, 2016

Magnetic module for power inductor, power inductor, and manufacturing method thereof

SAMSUNG ELECTRO MECH8 citations84
US9236186B2Jan 12, 2016

Multi-layered ceramic capacitor

SAMSUNG ELECTRO MECH7 citations84
US9087646B2Jul 21, 2015

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH7 citations84
US9048026B2Jun 2, 2015

Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor mounted thereon, and packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH12 citations84
US8804367B2Aug 12, 2014

Multilayer ceramic capacitor and board for mounting the same

SAMSUNG ELECTRO MECH13 citations84
US8385048B2Feb 26, 2013

Chip type laminated capacitor

SAMSUNG ELECTRO MECH5 citations84
US8373964B2Feb 12, 2013

Multi-layered ceramic capacitor

SAMSUNG ELECTRO MECH12 citations84
US8050012B2Nov 1, 2011

Multilayer chip capacitor and circuit board device including the same

SAMSUNG ELECTRO MECH8 citations84
US7990677B2Aug 2, 2011

Multilayer chip capacitor

SAMSUNG ELECTRO MECH7 citations84
US7961453B2Jun 14, 2011

Multilayer chip capacitor

SAMSUNG ELECTRO MECH9 citations84
US7920370B2Apr 5, 2011

Multilayer chip capacitor

SAMSUNG ELECTRO MECH7 citations84
US7675733B2Mar 9, 2010

Multilayer capacitor

SAMSUNG ELECTRO MECH10 citations84
US7599166B2Oct 6, 2009

Multilayer chip capacitor

SAMSUNG ELECTRO MECH15 citations84
US7567425B1Jul 28, 2009

Multilayer chip capacitor

SAMSUNG ELECTRO MECH14 citations84
US7502216B2Mar 10, 2009

Multilayer chip capacitor

SAMSUNG ELECTRO MECH14 citations84
US7262952B2Aug 28, 2007

Multilayer chip capacitor

SAMSUNG ELECTRO MECH16 citations84
US7149072B2Dec 12, 2006

Multilayered chip capacitor array

SAMSUNG ELECTRO MECH14 citations83
US7292430B2Nov 6, 2007

Multi-layer chip capacitor

SAMSUNG ELECTRO MECH17 citations82
US11342124B2May 24, 2022

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH2 citations73
US10847320B2Nov 24, 2020

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH2 citations73
US10622154B2Apr 14, 2020

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

SAMSUNG ELECTRO MECH2 citations73

SAMSUNG ELECTRONICS CO LTD

7 patents

LEE BYOUNG HWA

4 patents

AHN YOUNG GHYU

1 patent

SUMITOMO ELECTRO MECHANICS CO

1 patent

Showing the top 50 of 168 patents by PatentIndex Score.