P

Inventor

WU ZHEN-CHENG

TW39 patents
⚠️ This page may combine multiple inventors who share the name “WU ZHEN-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

18 patents
US8999839B2Apr 7, 2015

Semiconductor structure having an air-gap region and a method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG187 citations98
US7217648B2May 15, 2007

Post-ESL porogen burn-out for copper ELK integration

TAIWAN SEMICONDUCTOR MFG23 citations92
US7193325B2Mar 20, 2007

Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects

TAIWAN SEMICONDUCTOR MFG19 citations91
US7056826B2Jun 6, 2006

Method of forming copper interconnects

TAIWAN SEMICONDUCTOR MFG11 citations84
US7151315B2Dec 19, 2006

Method of a non-metal barrier copper damascene integration

TAIWAN SEMICONDUCTOR MFG11 citations83
US7196423B2Mar 27, 2007

Interconnect structure with dielectric barrier and fabrication method thereof

TAIWAN SEMICONDUCTOR MFG17 citations82
US8975749B2Mar 10, 2015

Method of making a semiconductor device including barrier layers for copper interconnect

TAIWAN SEMICONDUCTOR MFG5 citations73
US7253524B2Aug 7, 2007

Copper interconnects

TAIWAN SEMICONDUCTOR MFG9 citations73
US7160800B2Jan 9, 2007

Decreasing metal-silicide oxidation during wafer queue time

TAIWAN SEMICONDUCTOR MFG8 citations72
US7732923B2Jun 8, 2010

Impurity doped UV protection layer

TAIWAN SEMICONDUCTOR MFG2 citations63
US7485949B2Feb 3, 2009

Semiconductor device

TAIWAN SEMICONDUCTOR MFG4 citations63
US7259090B2Aug 21, 2007

Copper damascene integration scheme for improved barrier layers

TAIWAN SEMICONDUCTOR MFG4 citations63
US7135408B2Nov 14, 2006

Metal barrier integrity via use of a novel two step PVD-ALD deposition procedure

TAIWAN SEMICONDUCTOR MFG4 citations63
US6753607B1Jun 22, 2004

Structure for improving interlevel conductor connections

TAIWAN SEMICONDUCTOR MFG4 citations63
US7465676B2Dec 16, 2008

Method for forming dielectric film to improve adhesion of low-k film

TAIWAN SEMICONDUCTOR MFG3 citations62
US7247571B2Jul 24, 2007

Method for planarizing semiconductor structures

TAIWAN SEMICONDUCTOR MFG4 citations62
US6878621B2Apr 12, 2005

Method of fabricating barrierless and embedded copper damascene interconnects

TAIWAN SEMICONDUCTOR MFG5 citations62
US7834405B2Nov 16, 2010

Semiconductor device including I/O oxide and nitrided core oxide on substrate

TAIWAN SEMICONDUCTOR MFG0 citations52

TAIWAN SEMICONDUCTOR MFG CO LTD

10 patents

HU YEN-CHENG

5 patents

WU ZHEN-CHENG

2 patents

TAIWAN SEMICONDUCTOR MANFACTUR

1 patent

SU SHU-HUI

1 patent

LIU NAI-WEI

1 patent

AU OPTRONICS CORP

1 patent