P

Inventor

PENG JIANWEI

CN40 patents
⚠️ This page may combine multiple inventors who share the name “PENG JIANWEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES INC

24 patents
US10249538B1Apr 2, 2019

Method of forming vertical field effect transistors with different gate lengths and a resulting structure

GLOBALFOUNDRIES INC22 citations94
US9337306B2May 10, 2016

Multi-phase source/drain/gate spacer-epi formation

GLOBALFOUNDRIES INC26 citations94
US9419101B1Aug 16, 2016

Multi-layer spacer used in finFET

GLOBALFOUNDRIES INC20 citations91
US10446483B2Oct 15, 2019

Metal-insulator-metal capacitors with enlarged contact areas

GLOBALFOUNDRIES INC12 citations84
US10068810B1Sep 4, 2018

Multiple Fin heights with dielectric isolation

GLOBALFOUNDRIES INC9 citations84
US9947769B1Apr 17, 2018

Multiple-layer spacers for field-effect transistors

GLOBALFOUNDRIES INC14 citations84
US9887094B1Feb 6, 2018

Methods of forming EPI semiconductor material on the source/drain regions of a FinFET device

GLOBALFOUNDRIES INC14 citations84
US10784342B1Sep 22, 2020

Single diffusion breaks formed with liner protection for source and drain regions

GLOBALFOUNDRIES INC6 citations73
US9406752B2Aug 2, 2016

FinFET conformal junction and high EPI surface dopant concentration method and device

GLOBALFOUNDRIES INC3 citations72
US10410929B2Sep 10, 2019

Multiple gate length device with self-aligned top junction

GLOBALFOUNDRIES INC1 citations62
US10276689B2Apr 30, 2019

Method of forming a vertical field effect transistor (VFET) and a VFET structure

GLOBALFOUNDRIES INC1 citations62
US10262903B2Apr 16, 2019

Boundary spacer structure and integration

GLOBALFOUNDRIES INC1 citations62
US10211317B1Feb 19, 2019

Vertical-transport field-effect transistors with an etched-through source/drain cavity

GLOBALFOUNDRIES INC1 citations62
US10297675B1May 21, 2019

Dual-curvature cavity for epitaxial semiconductor growth

GLOBALFOUNDRIES INC1 citations58
US10910471B2Feb 2, 2021

Device with large EPI in FinFETs and method of manufacturing

GLOBALFOUNDRIES INC0 citations56
US10468310B2Nov 5, 2019

Spacer integration scheme for FNET and PFET devices

GLOBALFOUNDRIES INC0 citations52
US10453754B1Oct 22, 2019

Diffused contact extension dopants in a transistor device

GLOBALFOUNDRIES INC0 citations52
US10431665B2Oct 1, 2019

Multiple-layer spacers for field-effect transistors

GLOBALFOUNDRIES INC0 citations52
US10121868B1Nov 6, 2018

Methods of forming epi semiconductor material on a thinned fin in the source/drain regions of a FinFET device

GLOBALFOUNDRIES INC1 citations52
US9577040B2Feb 21, 2017

FinFET conformal junction and high epi surface dopant concentration method and device

GLOBALFOUNDRIES INC1 citations51
US9559176B2Jan 31, 2017

FinFET conformal junction and abrupt junction with reduced damage method and device

GLOBALFOUNDRIES INC0 citations51
US9397162B1Jul 19, 2016

FinFET conformal junction and abrupt junction with reduced damage method and device

GLOBALFOUNDRIES INC0 citations51
US10224330B2Mar 5, 2019

Self-aligned junction structures

GLOBALFOUNDRIES INC0 citations42
US9490174B2Nov 8, 2016

Fabricating raised fins using ancillary fin structures

GLOBALFOUNDRIES INC0 citations42

GLOBALFOUNDRIES US INC

9 patents

HANGZHOU PENNO PACKTECH CO LTD

4 patents

IBM

1 patent

CHINA TIESIJU CIVIL ENG GROUP

1 patent

ANHUI ZHONGTIE ENGINEERING MATERIAL TECH CO LTD

1 patent