Inventor

COSTA JULIO C

US90 patents

⚠️ This page may combine multiple inventors who share the name “COSTA JULIO C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COSTA JULIO C

QORVO US INC

Wafer-level package with enhanced performance and manufacturing method thereof

Microelectronics package with inductive element and magnetically enhanced mold compound component

Flip chip module with enhanced properties

Method of manufacture for a semiconductor device

Thermally enhanced semiconductor package with at least one heat extractor and process for making the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

Semiconductor package with reduced parasitic coupling effects and process for making the same

Thermally enhanced semiconductor package and process for making the same

Air-cavity module with enhanced device isolation

Method for manufacturing an integrated circuit package

Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer

Silicon-on-plastic semiconductor device with interfacial adhesion layer

Radio frequency (RF) switch

Thermally enhanced semiconductor package and process for making the same

Wafer-level package with enhanced performance

RF devices with enhanced performance and methods of forming the same

Thermally enhanced semiconductor package with thermal additive and process for making the same

Stacked field-effect transistor switch

Tunable inductor device

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation

Gallium-nitride-based module with enhanced electrical performance and process for making the same

RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same

Gallium-nitride-based module with enhanced electrical performance and process for making the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

Thermally enhanced semiconductor package with at least one heat extractor and process for making the same

RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same

Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer

RF MICRO DEVICES INC

Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer

Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer

Encapsulated dies with enhanced thermal performance

Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same

Method for manufacturing an integrated circuit package

Silicon-on-plastic semiconductor device and method of making the same

Encapsulated dies with enhanced thermal performance

Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer

MOTOROLA INC

Monolithic high frequency integrated circuit structure having a grounded source configuration

Enhancement mode RF device and fabrication method

Semiconductor transistor with stabilizing gate electrode

Compound semiconductor device having reduced temperature variability

SPRINT SPECTRUM LP

Method for allocating coverage area identifiers among nearby base stations

Method for sharing satellite positioning system information among nearby base stations

SEMICONDUCTOR COMPONENTS IND

Integrated circuit with a high speed narrow base width vertical PNP transistor

T MOBILE INNOVATIONS LLC

Methods and systems to support wireless local area network (WLAN) quality of service (QoS)

HONEYWELL INC

Hot clock complex logic