Inventor
SUZUKI TAKAYA
JP48 patents
⚠️ This page may combine multiple inventors who share the name “SUZUKI TAKAYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
19 patentsUS4969031ANov 6, 1990
Semiconductor devices and method for making the same
HITACHI LTD228 citations99
US4943837AJul 24, 1990
Thin film semiconductor device and method of fabricating the same
HITACHI LTD139 citations98
US4745088AMay 17, 1988
Vapor phase growth on semiconductor wafers
HITACHI LTD213 citations98
US4942441AJul 17, 1990
Thin film semiconductor device and method of manufacturing the same
HITACHI LTD144 citations97
US4954855ASep 4, 1990
Thin film transistor formed on insulating substrate
HITACHI LTD57 citations96
US4562637AJan 7, 1986
Method of manufacturing solar battery
HITACHI LTD70 citations96
US4388342AJun 14, 1983
Method for chemical vapor deposition
HITACHI LTD60 citations96
US5736753AApr 7, 1998
Semiconductor device for improved power conversion having a hexagonal-system single-crystal silicon carbide
HITACHI LTD71 citations95
US5153702AOct 6, 1992
Thin film semiconductor device and method for fabricating the same
HITACHI LTD81 citations94
US4100310AJul 11, 1978
Method of doping inpurities
HITACHI LTD53 citations92
US4017341AApr 12, 1977
Method of manufacturing semiconductor integrated circuit with prevention of substrate warpage
HITACHI LTD34 citations88
US4746961AMay 24, 1988
Field effect transistor
HITACHI LTD20 citations82
US4079506AMar 21, 1978
Method of preparing a dielectric-isolated substrate for semiconductor integrated circuitries
HITACHI LTD23 citations78
US4693758ASep 15, 1987
Method of making devices in silicon, on insulator regrown by laser beam
HITACHI LTD15 citations74
US4604159AAug 5, 1986
Method of forming a large number of monocrystalline semiconductor regions on the surface of an insulator
HITACHI LTD7 citations74
US4200877AApr 29, 1980
Temperature-compensated voltage reference diode with intermediate polycrystalline layer
HITACHI LTD17 citations73
US4491562AJan 1, 1985
Thermal fatigue resistant low-melting point solder alloys
HITACHI LTD8 citations72
US4173674ANov 6, 1979
Dielectric insulator separated substrate for semiconductor integrated circuits
HITACHI LTD8 citations68
US4164436AAug 14, 1979
Process for preparation of semiconductor devices utilizing a two-step polycrystalline deposition technique to form a diffusion source
HITACHI LTD6 citations63
SUZUKI MOTOR CORP
9 patentsUS10208647B2Feb 19, 2019
Saddle-ridden type vehicle
SUZUKI MOTOR CORP6 citations72
US10167767B2Jan 1, 2019
Motorcycle and saddle-ridden type vehicle
SUZUKI MOTOR CORP1 citations61
US10690038B2Jun 23, 2020
Motorcycle and saddle-ridden type vehicle
SUZUKI MOTOR CORP0 citations51
US10006336B2Jun 26, 2018
Saddle-ridden vehicle
SUZUKI MOTOR CORP1 citations51
US9964025B2May 8, 2018
Engine and motorcycle
SUZUKI MOTOR CORP0 citations51
US9850803B2Dec 26, 2017
Saddle-ridden type vehicle
SUZUKI MOTOR CORP1 citations51
US10094267B2Oct 9, 2018
Cooling water flow control for a saddle-ridden type vehicle
SUZUKI MOTOR CORP0 citations41
US10640170B2May 5, 2020
Straddle-type vehicle
SUZUKI MOTOR CORP0 citations40
US10294854B2May 21, 2019
Saddle-ridden vehicle
SUZUKI MOTOR CORP0 citations40
NEC CORP
4 patentsUS6252776B1Jun 26, 2001
Heat radiating member for heat generating device
NEC CORP20 citations93
US5600580AFeb 4, 1997
Notebook type information processing apparatus having input function with pen
NEC CORP50 citations87
USD353584SDec 20, 1994
Portable personal computer
NEC CORP5 citations60
USD341578SNov 23, 1993
Lap-top computer
NEC CORP0 citations48
TEIJIN LTD
3 patentsUS11746445B2Sep 5, 2023
Carbon fiber bundle, prepreg, and fiber-reinforced composite material
TEIJIN LTD0 citations61
US11560646B2Jan 24, 2023
Carbon fiber bundle, prepreg, and fiber-reinforced composite material
TEIJIN LTD0 citations61
US12084546B2Sep 10, 2024
Thermosetting resin composition, film adhesive, prepreg, and production method thereof
TEIJIN LTD0 citations56