Inventor

COBARRUVIAZ MARIA L

US6 patents

⚠️ This page may combine multiple inventors who share the name “COBARRUVIAZ MARIA L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD CO

5 patents

US5162260ANov 10, 1992

Stacked solid via formation in integrated circuit systems

HEWLETT PACKARD CO124 citations97

US5055425AOct 8, 1991

Stacked solid via formation in integrated circuit systems

HEWLETT PACKARD CO121 citations97

US6011314AJan 4, 2000

Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps

HEWLETT PACKARD CO189 citations96

US5221421AJun 22, 1993

Controlled etching process for forming fine-geometry circuit lines on a substrate

HEWLETT PACKARD CO35 citations89

US5200300AApr 6, 1993

Methods for forming high density multi-chip carriers

HEWLETT PACKARD CO16 citations73

(unassigned)

1 patent

US5399528AMar 21, 1995

Multi-layer fabrication in integrated circuit systems