Inventor
SCHOLZ KENNETH D
US13 patents
⚠️ This page may combine multiple inventors who share the name “SCHOLZ KENNETH D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD CO
8 patentsUS5162260ANov 10, 1992
Stacked solid via formation in integrated circuit systems
HEWLETT PACKARD CO124 citations97
US5055425AOct 8, 1991
Stacked solid via formation in integrated circuit systems
HEWLETT PACKARD CO121 citations97
US6011314AJan 4, 2000
Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps
HEWLETT PACKARD CO189 citations96
US5262925ANov 16, 1993
Tab frame with area array edge contacts
HEWLETT PACKARD CO28 citations91
US5162975ANov 10, 1992
Integrated circuit demountable TAB apparatus
HEWLETT PACKARD CO23 citations91
US5200300AApr 6, 1993
Methods for forming high density multi-chip carriers
HEWLETT PACKARD CO16 citations73
US5086335AFeb 4, 1992
Tape automated bonding system which facilitate repair
HEWLETT PACKARD CO9 citations73
US3946302AMar 23, 1976
Power regulator with R.M.S. output voltage as function of unregulated D.C.
HEWLETT PACKARD CO11 citations73