Inventor
CHAO CLINTON C
US9 patents
⚠️ This page may combine multiple inventors who share the name “CHAO CLINTON C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD CO
7 patentsUS5162260ANov 10, 1992
Stacked solid via formation in integrated circuit systems
HEWLETT PACKARD CO124 citations97
US5055425AOct 8, 1991
Stacked solid via formation in integrated circuit systems
HEWLETT PACKARD CO121 citations97
US5029386AJul 9, 1991
Hierarchical tape automated bonding method
HEWLETT PACKARD CO206 citations94
US5221421AJun 22, 1993
Controlled etching process for forming fine-geometry circuit lines on a substrate
HEWLETT PACKARD CO35 citations89
US6242075B1Jun 5, 2001
Planar multilayer ceramic structures with near surface channels
HEWLETT PACKARD CO19 citations79
US5200300AApr 6, 1993
Methods for forming high density multi-chip carriers
HEWLETT PACKARD CO16 citations73
US5086335AFeb 4, 1992
Tape automated bonding system which facilitate repair
HEWLETT PACKARD CO9 citations73