Inventor · disambiguated record
Tamotsu Mori
Also filed as: MORI TAMOTSU
13 granted patents·1 pending application·323 citations·filing 1981–2003
93Inventor score
Files withMATSUSHITA ELECTRIC WORKS LTD3NITTO KOHKI CO3MITSUBISHI METAL CORP2PROCTER & GAMBLE2MAN DESIGN CO1
Top patents by PatentIndex Score
14 records- 0193US4879535ARemotely controllable circuit breakerMATSUSHITA ELECTRIC WORKS LTD·Filed 1988·Granted Nov 7, 1989·63 cites·12 claims
- 0276US4854833AElectromagnetically reciprocating apparatus with adjustable bounce chamberNITTO KOHKI CO·Filed 1988·Granted Aug 8, 1989·41 cites·2 claims
- 0373US5035016AAir-mat apparatusNIKKI CO LTD·Filed 1990·Granted Jul 30, 1991·67 cites·9 claims
- 0468US5100304ASolenoid-operated reciprocating pumpNITTO KOHKI CO·Filed 1991·Granted Mar 31, 1992·29 cites·3 claims
- 0566US5222878AElectromagnetic reciprocating pumpNITTO KOHKI CO·Filed 1992·Granted Jun 29, 1993·25 cites·11 claims
- 0663US4885135AFine gold alloy wire for bonding of a semi-conductor deviceMITSUBISHI METAL CORP·Filed 1989·Granted Dec 5, 1989·23 cites·4 claims
- 0761US4370634ACircuit breakerMATSUSHITA ELECTRIC WORKS LTD·Filed 1981·Granted Jan 25, 1983·10 cites·5 claims
- 0858US4382240ACircuit breakerMATSUSHITA ELECTRIC WORKS LTD·Filed 1981·Granted May 3, 1983·9 cites·4 claims
- 0957US5055011AElectromagnetic type reciprocating pumpMAN DESIGN CO·Filed 1990·Granted Oct 8, 1991·20 cites·1 claims
- 1051US6017552ASolid cosmetic compositionPROCTER & GAMBLE·Filed 1999·Granted Jan 25, 2000·11 cites·12 claims
- 1150US7792142B2Data transmission device, data transmission method, data transmission program, data reception device, data reception method, data reception program, and communication systemSHARP KK·Filed 2003·Granted Sep 7, 2010·2 cites·26 claims
- 1250US5071619AFine gold alloy wire for bonding of a semiconductor deviceMITSUBISHI METAL CORP·Filed 1989·Granted Dec 10, 1991·13 cites·58 claims
- 1348US5948417ASolid cosmetic compositionPROCTER & GAMBLE·Filed 1995·Granted Sep 7, 1999·10 cites·6 claims
- 1435US2001032708A1Electrode plate for plasma etching equipment for forming uniformly-etched surfaceMITSUBISHI MATERIALS CORP·Filed 2001·Application pending·0 cites
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