Inventor
LEUSCHNER RAINER
DE75 patents
⚠️ This page may combine multiple inventors who share the name “LEUSCHNER RAINER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SIEMENS AG
21 patentsUS5234793AAug 10, 1993
Method for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after development
SIEMENS AG144 citations98
US5250375AOct 5, 1993
Photostructuring process
SIEMENS AG66 citations96
US5173393ADec 22, 1992
Etch-resistant deep ultraviolet resist process having an aromatic treating step after development
SIEMENS AG94 citations96
US6251558B1Jun 26, 2001
Chemically amplified resist
SIEMENS AG20 citations93
US5234794AAug 10, 1993
Photostructuring method
SIEMENS AG50 citations93
US6582888B1Jun 24, 2003
Method for producing organic electroluminescent components
SIEMENS AG54 citations92
US6576358B2Jun 10, 2003
Method of discharging reaction water in PEM fuel cells and fuel cell for carrying out the method
SIEMENS AG28 citations92
US6042993AMar 28, 2000
Photolithographic structure generation process
SIEMENS AG35 citations92
US5556812ASep 17, 1996
Connection and build-up technique for multichip modules
SIEMENS AG40 citations92
US5037876AAug 6, 1991
Planarizing dielectric
SIEMENS AG46 citations91
US6503655B1Jan 7, 2003
Gas diffusion electrode and its production
SIEMENS AG31 citations90
US5863705AJan 26, 1999
Photolithographic pattern generation
SIEMENS AG12 citations74
US5851733ADec 22, 1998
Photolithographic pattern generation
SIEMENS AG8 citations74
US5512334AApr 30, 1996
Method for the production of a bottom resist
SIEMENS AG7 citations74
US5368901ANov 29, 1994
Method for the production of a bottom resist
SIEMENS AG7 citations74
US6361666B1Mar 26, 2002
Gas diffusion electron, process for producing an electrode an carbonizable composite
SIEMENS AG9 citations73
US6310401B1Oct 30, 2001
Substrate for high-voltage modules
SIEMENS AG14 citations73
US5703186ADec 30, 1997
Mixed polymers
SIEMENS AG5 citations73
US5384220AJan 24, 1995
Production of photolithographic structures
SIEMENS AG16 citations73
US5262283ANov 16, 1993
Method for producing a resist structure
SIEMENS AG11 citations73
US5229258AJul 20, 1993
Method for producing a resist structure
SIEMENS AG11 citations73
INFINEON TECHNOLOGIES AG
12 patentsUS9593009B2Mar 14, 2017
Apparatus comprising and a method for manufacturing an embedded MEMS device
INFINEON TECHNOLOGIES AG46 citations98
US6704220B2Mar 9, 2004
Layout for thermally selected cross-point MRAM cell
INFINEON TECHNOLOGIES AG63 citations96
US7643332B2Jan 5, 2010
MRAM cell using multiple axes magnetization and method of operation
INFINEON TECHNOLOGIES AG32 citations93
US6614048B2Sep 2, 2003
Memory element with molecular or polymeric layers, memory cell, memory array, and smart card
INFINEON TECHNOLOGIES AG21 citations93
US6171755B1Jan 9, 2001
Chemically amplified resist
INFINEON TECHNOLOGIES AG26 citations93
US6815248B2Nov 9, 2004
Material combinations for tunnel junction cap layer, tunnel junction hard mask and tunnel junction stack seed layer in MRAM processing
INFINEON TECHNOLOGIES AG32 citations92
US9884757B2Feb 6, 2018
MEMS sensor package systems and methods
INFINEON TECHNOLOGIES AG11 citations84
US7088612B2Aug 8, 2006
MRAM with vertical storage element in two layer-arrangement and field sensor
INFINEON TECHNOLOGIES AG11 citations84
US7083990B1Aug 1, 2006
Method of fabricating MRAM cells
INFINEON TECHNOLOGIES AG13 citations84
US7344896B2Mar 18, 2008
Ferromagnetic liner for conductive lines of magnetic memory cells and methods of manufacturing thereof
INFINEON TECHNOLOGIES AG14 citations82
US10102967B2Oct 16, 2018
Method of manufacturing an inductor core for a chip assembly and chip assembly
INFINEON TECHNOLOGIES AG3 citations73
US10859457B2Dec 8, 2020
Sensor device including sensor unit for a gaseous medium
INFINEON TECHNOLOGIES AG3 citations71
QIMONDA AG
4 patentsUS7855435B2Dec 21, 2010
Integrated circuit, method of manufacturing an integrated circuit, and memory module
QIMONDA AG29 citations93
US7697322B2Apr 13, 2010
Integrated circuits; method for manufacturing an integrated circuit; method for decreasing the influence of magnetic fields; memory module
QIMONDA AG41 citations93
US7660151B2Feb 9, 2010
Method for programming an integrated circuit, method for programming a plurality of cells, integrated circuit, cell arrangement
QIMONDA AG34 citations93
US7903454B2Mar 8, 2011
Integrated circuit, memory cell array, memory module, and method of operating an integrated circuit
QIMONDA AG9 citations84
IBM
2 patentsMEYER THORSTEN
2 patentsUS8183696B2May 22, 2012
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
MEYER THORSTEN47 citations97
US8741690B2Jun 3, 2014
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
MEYER THORSTEN16 citations92
ALTIS SEMICONDUCTOR SNC
2 patentsSIEMENS AKTINEGESELLSCHAFT
1 patentWINKLER BERNHARD
1 patentPARK HUMAN
1 patentFUERGUT EDWARD
1 patentOSRAM OPTO SEMICONDUCTORS GMBH
1 patentLEUSCHNER RAINER
1 patentMACKH GUNTHER
1 patentShowing the top 50 of 75 patents by PatentIndex Score.