Inventor
TAKEZAWA HIROAKI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “TAKEZAWA HIROAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
23 patentsUS6300576B1Oct 9, 2001
Printed-circuit board having projection electrodes and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD74 citations96
US6853074B2Feb 8, 2005
Electronic part, an electronic part mounting element and a process for manufacturing such the articles
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations92
US6694613B2Feb 24, 2004
Method for producing a printed-circuit board having projection electrodes
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations92
US6521144B2Feb 18, 2003
Conductive adhesive and connection structure using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD15 citations92
US6512183B2Jan 28, 2003
Electronic component mounted member and repair method thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD25 citations92
US6510059B2Jan 21, 2003
Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US6465082B1Oct 15, 2002
Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD31 citations92
US6207550B1Mar 27, 2001
Method for fabricating bump electrodes with a leveling step for uniform heights
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD30 citations92
US6675474B2Jan 13, 2004
Electronic component mounted member and repair method thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD14 citations84
US6429382B1Aug 6, 2002
Electrical mounting structure having an elution preventive film
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations83
US6916433B2Jul 12, 2005
Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD17 citations81
US6749889B2Jun 15, 2004
Method for producing mounting structure for an electronic component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations74
US6666994B2Dec 23, 2003
Conductive adhesive and packaging structure using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9 citations74
US6488869B2Dec 3, 2002
Conductive paste, its manufacturing method, and printed wiring board using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations74
US7151306B2Dec 19, 2006
Electronic part, and electronic part mounting element and an process for manufacturing such the articles
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations63
US6620345B2Sep 16, 2003
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations63
US6569512B2May 27, 2003
Mounting structure for an electronic component and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations63
US6524721B2Feb 25, 2003
Conductive adhesive and packaging structure using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations63
US6376051B1Apr 23, 2002
Mounting structure for an electronic component and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations63
US6203919B1Mar 20, 2001
Insulating film and method for preparing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations62
US6495247B1Dec 17, 2002
Functional member having molecular layer on its surface and method of producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations61
US5817190AOct 6, 1998
Flux for soft soldering
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations60
US6749774B2Jun 15, 2004
Conductive adhesive and connection structure using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1 citations52