Inventor
KIMIZUKA RYOICHI
JP13 patents
⚠️ This page may combine multiple inventors who share the name “KIMIZUKA RYOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EBARA CORP
9 patentsUS6709563B2Mar 23, 2004
Copper-plating liquid, plating method and plating apparatus
EBARA CORP68 citations95
US6517894B1Feb 11, 2003
Method for plating a first layer on a substrate and a second layer on the first layer
EBARA CORP49 citations95
US6638411B1Oct 28, 2003
Method and apparatus for plating substrate with copper
EBARA CORP46 citations92
US6627066B1Sep 30, 2003
Method of measuring the concentration of a leveler in a plating liquid
EBARA CORP22 citations91
US6811658B2Nov 2, 2004
Apparatus for forming interconnects
EBARA CORP14 citations83
US7033463B1Apr 25, 2006
Substrate plating method and apparatus
EBARA CORP10 citations73
US6908534B2Jun 21, 2005
Substrate plating method and apparatus
EBARA CORP7 citations72
US7553400B2Jun 30, 2009
Plating apparatus and plating method
EBARA CORP6 citations60
US7172683B2Feb 6, 2007
Method of managing a plating liquid used in a plating apparatus
EBARA CORP1 citations50