Inventor
CORBIN JR JOHN S
US18 patents
⚠️ This page may combine multiple inventors who share the name “CORBIN JR JOHN S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS6024330AFeb 15, 2000
Uni-axial floor anchor and leveler for racks
IBM92 citations97
US6425488B1Jul 30, 2002
Integrated flexible frame tie down retention system for raised and non-raised floor applications
IBM67 citations96
US6425648B1Jul 30, 2002
Modular and flexible server frame enclosure
IBM57 citations96
US6475011B1Nov 5, 2002
Land grid array socket actuation hardware for MCM applications
IBM52 citations92
US6449162B1Sep 10, 2002
Removable land grid array cooling solution
IBM74 citations92
US7777329B2Aug 17, 2010
Heatsink apparatus for applying a specified compressive force to an integrated circuit device
IBM24 citations91
US6634095B2Oct 21, 2003
Apparatus for mounting a land grid array module
IBM19 citations91
US7119433B2Oct 10, 2006
Packaging for enhanced thermal and structural performance of electronic chip modules
IBM23 citations90
US6757965B2Jul 6, 2004
Method of installing a land grid array multi-chip modules
IBM15 citations82
US6802733B2Oct 12, 2004
Topside installation apparatus for land grid array modules
IBM8 citations73
US6511282B2Jan 28, 2003
Modular and flexible service frame enclosure
IBM10 citations73
US6921272B2Jul 26, 2005
Method and apparatus for providing positive contact force in an electrical assembly
IBM2 citations63
US7701720B2Apr 20, 2010
Electronic assembly and techniques for installing a heatsink in an electronic assembly
IBM4 citations62
US7687894B2Mar 30, 2010
IC chip package having automated tolerance compensation
IBM4 citations62
US4589790AMay 20, 1986
Method and apparatus for controlling escapement
IBM2 citations60
US6765397B2Jul 20, 2004
Apparatus and method for testing land grid array modules
IBM5 citations59