Inventor
COOK DUANE
US7 patents
⚠️ This page may combine multiple inventors who share the name “COOK DUANE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS6331446B1Dec 18, 2001
Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state
INTEL CORP25 citations92
US7141448B2Nov 28, 2006
Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials
INTEL CORP17 citations83
US6528345B1Mar 4, 2003
Process line for underfilling a controlled collapse
INTEL CORP16 citations83
US6907147B2Jun 14, 2005
Method and apparatus for aligning and orienting polarization maintaining optical fibers
INTEL CORP8 citations65