Inventor

WANG MILL-JER

TW80 patents

⚠️ This page may combine multiple inventors who share the name “WANG MILL-JER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG MILL-JER

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor structure and manufacturing method thereof

Testing holders for chip unit and die package

Testing holders for chip unit and die package

Testing holders for chip unit and die package

Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Testing holders for chip unit and die package

3D IC testing apparatus

Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Alignment testing for tiered semiconductor structure

Integrated circuit test system and method

Testing holders for chip unit and die package

Semiconductor structure and manufacturing method thereof

Universal test mechanism for semiconductor device

Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Semiconductor device, test system and method of the same

Circuit probing structures and methods for probing the same

Structure and method for testing stacked CMOS structure

Integrated fan-out package-on-package testing

Alignment testing for tiered semiconductor structure

Alignment testing for tiered semiconductor structure

Test circuit and method

Antenna testing device and method for high frequency antennas

Testing module and testing method using the same

Testing module and testing method using the same

Testing module and testing method using the same

Testing holders for chip unit and die package

Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Probe card partition scheme

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Test probing structure

Alignment testing for tiered semiconductor structure

Testing apparatus and testing method

Probe head structure of probe card and testing method

Probe head structure of probe card and testing method

Test circuit and method

WANG MILL-JER

Three-dimensional integrated circuit and method for wireless information access thereof

Probe cards for probing integrated circuits

3D IC testing apparatus

Power compensation in 3DIC testing

Test probing structure

Circuit probing structures and methods for probing the same

TAIWAN SEMICONDUCTOR MFG

Testing holders for chip unit and die package

Wafer level test probe card

GOEL SANDEEP KUMAR

Probe card partition scheme

Interposers of 3-dimensional integrated circuit package systems and methods of designing the same

LIN HUNG-CHIH

Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)

Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC)

CHOU YOU-HUA

Mechanisms for resistivity measurement of bump structures

PU HAN-PING

Method and system of testing a semiconductor device