Inventor
CHEN CHING-FANG
TW30 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHING-FANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
18 patentsUS10678973B2Jun 9, 2020
Machine-learning design enablement platform
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations85
US9679840B2Jun 13, 2017
Method for layout design and structure with inter-layer vias
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations82
US11017149B2May 25, 2021
Machine-learning design enablement platform
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11002788B2May 11, 2021
Circuit test structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10288676B2May 14, 2019
Circuit test structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11646313B2May 9, 2023
Semiconductor and circuit structures, and related methods
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12272691B2Apr 8, 2025
Semiconductor and circuit structures, and related methods
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12253558B2Mar 18, 2025
Circuit test structure and method of using
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11828790B2Nov 28, 2023
Circuit test structure and method of using
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11585831B2Feb 21, 2023
Test probing structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12154851B2Nov 26, 2024
Method of forming a semiconductor device with inter-layer vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11114376B2Sep 7, 2021
System for layout design of structure with inter layer vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11200364B2Dec 14, 2021
Method and associated system for circuit design
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US10782318B2Sep 22, 2020
Test probing structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9689914B2Jun 27, 2017
Method of testing a three-dimensional integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9613174B2Apr 4, 2017
Common template for electronic article
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10566278B2Feb 18, 2020
Method for layout design and structure with inter-layer vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9952279B2Apr 24, 2018
Apparatus for three dimensional integrated circuit testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations38
GLOBAL UNICHIP CORP
5 patentsUS11031923B1Jun 8, 2021
Interface device and interface method for 3D semiconductor device
GLOBAL UNICHIP CORP2 citations71
US11699683B2Jul 11, 2023
Semiconductor device in 3D stack with communication interface and managing method thereof
GLOBAL UNICHIP CORP0 citations61
US11144485B1Oct 12, 2021
Interface for semiconductor device with symmetric bond pattern and method for arranging interface thereof
GLOBAL UNICHIP CORP0 citations61
US11687472B2Jun 27, 2023
Interface for semiconductor device and interfacing method thereof
GLOBAL UNICHIP CORP0 citations50
US11675731B2Jun 13, 2023
Data protection system and method thereof for 3D semiconductor device
GLOBAL UNICHIP CORP0 citations50