Inventor

VOLANT RICHARD P

US83 patents

⚠️ This page may combine multiple inventors who share the name “VOLANT RICHARD P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VOLANT RICHARD P

IBM

Perpendicular torsion micro-electromechanical switch

Method of fabricating micro-electromechanical switches on CMOS compatible substrates

Micro electromechanical switch having self-aligned spacers

Common ball-limiting metallurgy for I/O sites

Micro-electromechanical varactor with enhanced tuning range

Selective plating process

Pattern-sensitive electrolytic metal plating

Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environment

Structure and method for self aligned vertical plate capacitor

Micro-electromechanical varactor with enhanced tuning range

Production of metal insulator metal (MIM) structures using anodizing process

Process and structure for 50+ gigahertz transistor

Method of forming a crack stop structure and diffusion barrier in integrated circuits

Diaphragm activated micro-electromechanical switch

Method of forming suspended transmission line structures in back end of line processing

Damascene integration scheme for developing metal-insulator-metal capacitors

Bipolar transistor having self-aligned silicide and a self-aligned emitter contact border

Fuse structure and method to form the same

Method of fabricating micro-electromechanical switches on CMOS compatible substrates

Electromechanical device and a process of preparing same

Encapsulated metal structures for semiconductor devices and MIM capacitors including the same

Process for removing chemical mechanical polishing residual slurry

Encapsulated metal structures for semiconductor devices and MIM capacitors including the same

Noble metal contacts for micro-electromechanical switches

Method of fabricating a high Q factor integrated circuit inductor

Semiconductor device structures with backside contacts for improved heat dissipation and reduced parasitic resistance

Planar vertical resistor and bond pad resistor and related method

Forming of high aspect ratio conductive structure using injection molded solder

High Q factor integrated circuit inductor

Multi-level RF passive device

Check valve for micro electro mechanical structure devices

Micro-electromechanical switch having a conductive compressible electrode

Protected through semiconductor via (TSV)

Micro-electromechanical sub-assembly having an on-chip transfer mechanism

Suspended transmission line structures in back end of line processing

Structure and method for reducing thermo-mechanical stress in stacked vias

Optimized annular copper TSV

Planar vertical resistor and bond pad resistor

Production of metal insulator metal (MIM) structures using anodizing process

Method for BEOL resistor tolerance improvement using anodic oxidation

Fuse structure and method to form the same

FAROOQ MUKTA G

Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation last

Metal-contamination-free through-substrate via structure

TSV pillar as an interconnecting structure

Alignment marks to enable 3D integration

Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip

VOLANT RICHARD P

Method of fabricating coaxial through-silicon via

Coaxial through-silicon via

Method and structure of forming backside through silicon via connections

ANDRY PAUL S

Optimized annular copper TSV