Inventor
MANDEL LARRY M
US9 patents
Patents
9 patentsUS7180745B2Feb 20, 2007
Flip chip heat sink package and method
DELPHI TECH INC77 citations96
US7352585B2Apr 1, 2008
Flip chip heat sink package and method
DELPHI TECH INC37 citations91
US6700195B1Mar 2, 2004
Electronic assembly for removing heat from a flip chip
DELPHI TECH INC31 citations91
US7616448B2Nov 10, 2009
Wrap-around overmold for electronic assembly
DELPHI TECH INC43 citations90
US7455552B1Nov 25, 2008
Overmolded electronic assembly with metal seal ring
DELPHI TECH INC22 citations89
US7230829B2Jun 12, 2007
Overmolded electronic assembly with insert molded heat sinks
DELPHI TECH INC17 citations82
US7416011B2Aug 26, 2008
Electronic assembly having a substrate laminated within a backplate cavity
DELPHI TECH INC7 citations73
US6905349B1Jun 14, 2005
Technique for connector to printed circuit board decoupling to eliminate flexure
DELPHI TECH INC11 citations73
US7462077B2Dec 9, 2008
Overmolded electronic assembly
DELPHI TECH INC5 citations59