Inventor

GAMBEE CHRISTOPHER J

US24 patents

⚠️ This page may combine multiple inventors who share the name “GAMBEE CHRISTOPHER J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GAMBEE CHRISTOPHER J

MICRON TECHNOLOGY INC

Methods of fabricating conductive traces and resulting structures

Semiconductor devices and methods for backside photo alignment

Semiconductor structures comprising at least one through-substrate via filled with conductive materials

Intermediate semiconductor device structures

Semiconductor devices having discretely located passivation material, and associated systems and methods

Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods

Semiconductor devices and methods for backside photo alignment

Die features for self-alignment during die bonding

Die features for self-alignment during die bonding

Pillar on pad interconnect structures, semiconductor devices including same and related methods

Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography

Reduction of roughness on a sidewall of an opening

Method to create a metal pattern using a damascene-like process

Devices with three-dimensional structures and support elements to increase adhesion to substrates

Semiconductor devices having discretely located passivation material, and associated systems and methods

Methods for enhancing adhesion of three-dimensional structures to substrates

Methods of fabricating conductive traces and resulting structures

Methods of selectively removing a substrate material

Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography

Semiconductor devices having discretely located passivation material, and associated systems and methods

Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods

GAMBEE CHRISTOPHER J

Methods of forming a metal pattern

Methods of forming a metal pattern and semiconductor device structure

FAY OWEN R

Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods