Inventor
JANG KI YOUN
KR36 patents
⚠️ This page may combine multiple inventors who share the name “JANG KI YOUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
10 patentsUS7537962B2May 26, 2009
Method of fabricating a shielded stacked integrated circuit package system
STATS CHIPPAC LTD78 citations98
US8035235B2Oct 11, 2011
Integrated circuit packaging system with package-on-package and method of manufacture thereof
STATS CHIPPAC LTD21 citations93
US8018040B2Sep 13, 2011
Shielded stacked integrated circuit packaging system and method of manufacture thereof
STATS CHIPPAC LTD9 citations84
US7679177B2Mar 16, 2010
Integrated circuit packaging system with passive components
STATS CHIPPAC LTD10 citations84
US7909233B2Mar 22, 2011
Method of manufacturing a semiconductor package with fine pitch lead fingers
STATS CHIPPAC LTD7 citations83
US7741726B2Jun 22, 2010
Integrated circuit underfill package system
STATS CHIPPAC LTD8 citations82
US7485502B2Feb 3, 2009
Integrated circuit underfill package system
STATS CHIPPAC LTD13 citations82
US7772683B2Aug 10, 2010
Stacked integrated circuit package-in-package system
STATS CHIPPAC LTD7 citations74
US7731078B2Jun 8, 2010
Semiconductor system with fine pitch lead fingers
STATS CHIPPAC LTD7 citations72
US8368200B2Feb 5, 2013
Shielded stacked integrated circuit packaging system and method of manufacture thereof
STATS CHIPPAC LTD1 citations63
SAMSUNG ELECTRONICS CO LTD
8 patentsUS9582051B2Feb 28, 2017
Mobile communication terminal having radiant-heat sheet
SAMSUNG ELECTRONICS CO LTD6 citations82
US10340737B2Jul 2, 2019
Electronic device and method for controlling fan of electronic device
SAMSUNG ELECTRONICS CO LTD2 citations73
US10197457B2Feb 5, 2019
Heating control method and electronic device thereof
SAMSUNG ELECTRONICS CO LTD6 citations72
US10698461B2Jun 30, 2020
Electronic device and heat control method based on temperature of battery in electronic device
SAMSUNG ELECTRONICS CO LTD2 citations71
US10064318B2Aug 28, 2018
Shield can assembly and electronic device including the same
SAMSUNG ELECTRONICS CO LTD2 citations68
USRE48641EJul 13, 2021
Mobile communication terminal having radiant-heat sheet
SAMSUNG ELECTRONICS CO LTD0 citations60
US10470345B2Nov 5, 2019
Electronic device including shield structure
SAMSUNG ELECTRONICS CO LTD1 citations59
US10842057B2Nov 17, 2020
Shield can assembly and electronic device including the same
SAMSUNG ELECTRONICS CO LTD0 citations47
JANG KI YOUN
4 patentsUS8304900B2Nov 6, 2012
Integrated circuit packaging system with stacked lead and method of manufacture thereof
JANG KI YOUN120 citations97
US8471394B2Jun 25, 2013
Integrated circuit packaging system with package-on-package and method of manufacture thereof
JANG KI YOUN22 citations92
US8772916B2Jul 8, 2014
Integrated circuit package system employing mold flash prevention technology
JANG KI YOUN2 citations62
US8252615B2Aug 28, 2012
Integrated circuit package system employing mold flash prevention technology
JANG KI YOUN3 citations62
CHIPPAC INC
4 patentsLEE HUN TEAK
3 patentsUS9129826B2Sep 8, 2015
Epoxy bump for overhang die
LEE HUN TEAK6 citations71
US8519517B2Aug 27, 2013
Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
LEE HUN TEAK0 citations50
US8256660B2Sep 4, 2012
Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof
LEE HUN TEAK0 citations50