Inventor
JAMES STEPHEN L
US27 patents
⚠️ This page may combine multiple inventors who share the name “JAMES STEPHEN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
23 patentsUS7323767B2Jan 29, 2008
Standoffs for centralizing internals in packaging process
MICRON TECHNOLOGY INC121 citations99
US6979595B1Dec 27, 2005
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
MICRON TECHNOLOGY INC18 citations92
US6815835B2Nov 9, 2004
Single sided adhesive tape for compound diversion on BOC substrates
MICRON TECHNOLOGY INC22 citations92
US6518678B2Feb 11, 2003
Apparatus and method for reducing interposer compression during molding process
MICRON TECHNOLOGY INC26 citations92
US6451629B2Sep 17, 2002
Leadframe alteration to direct compound flow into package
MICRON TECHNOLOGY INC19 citations92
US6278175B1Aug 21, 2001
Leadframe alteration to direct compound flow into package
MICRON TECHNOLOGY INC21 citations92
US6969918B1Nov 29, 2005
System for fabricating semiconductor components using mold cavities having runners configured to minimize venting
MICRON TECHNOLOGY INC13 citations89
US7459797B2Dec 2, 2008
Standoffs for centralizing internals in packaging process
MICRON TECHNOLOGY INC9 citations84
US7049685B2May 23, 2006
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
MICRON TECHNOLOGY INC14 citations84
US7927923B2Apr 19, 2011
Method and apparatus for directing molding compound flow and resulting semiconductor device packages
MICRON TECHNOLOGY INC5 citations74
US7053467B2May 30, 2006
Leadframe alteration to direct compound flow into package
MICRON TECHNOLOGY INC5 citations74
US6690086B2Feb 10, 2004
Apparatus and method for reducing interposer compression during molding process
MICRON TECHNOLOGY INC6 citations74
US6396133B1May 28, 2002
Semiconductor device with heat-dissipating lead-frame and process of manufacturing same
MICRON TECHNOLOGY INC13 citations74
US7501309B2Mar 10, 2009
Standoffs for centralizing internals in packaging process
MICRON TECHNOLOGY INC1 citations63
US7462510B2Dec 9, 2008
Standoffs for centralizing internals in packaging process
MICRON TECHNOLOGY INC3 citations63
US7271037B2Sep 18, 2007
Leadframe alteration to direct compound flow into package
MICRON TECHNOLOGY INC2 citations63
US6734372B2May 11, 2004
Gate area relief strip for a molded I/C package
MICRON TECHNOLOGY INC2 citations63
US6657132B2Dec 2, 2003
Single sided adhesive tape for compound diversion on BOC substrates
MICRON TECHNOLOGY INC2 citations63
US7186589B2Mar 6, 2007
Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting
MICRON TECHNOLOGY INC2 citations60
US7265453B2Sep 4, 2007
Semiconductor component having dummy segments with trapped corner air
MICRON TECHNOLOGY INC4 citations59
US8716847B2May 6, 2014
Inserts for directing molding compound flow and semiconductor die assemblies
MICRON TECHNOLOGY INC0 citations52
US7271036B2Sep 18, 2007
Leadframe alteration to direct compound flow into package
MICRON TECHNOLOGY INC0 citations52
US7247927B2Jul 24, 2007
Leadframe alteration to direct compound flow into package
MICRON TECHNOLOGY INC0 citations52
JAMES STEPHEN L
3 patentsUS7054161B1May 30, 2006
Slotted adhesive for die-attach in BOC and LOC packages
JAMES STEPHEN L25 citations91
US8399966B2Mar 19, 2013
Inserts for directing molding compound flow and semiconductor die assemblies
JAMES STEPHEN L1 citations61
US8207599B2Jun 26, 2012
Method and apparatus for directing molding compound flow and resulting semiconductor device packages
JAMES STEPHEN L3 citations61