Inventor · disambiguated record
Keiji Miki
Also filed as: MIKI KEIJI
15 granted patents·2 pending applications·269 citations·filing 1991–2018
93Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD4SUMITOMO PRECISION PROD CO4MIKI KEIJI3PANASONIC CORP3SUMITOMO METAL IND2
Top patents by PatentIndex Score
17 records- 0193US7279357B2Method for fabricating a chip-scale-packaging (CSP) having an inductorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Oct 9, 2007·30 cites·18 claims
- 0290US6914331B2Semiconductor device having an inductor formed on a region of an insulating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jul 5, 2005·55 cites·8 claims
- 0388US5625229AHeat sink fin assembly for cooling an LSI packageSUMITOMO METAL IND·Filed 1995·Granted Apr 29, 1997·105 cites·32 claims
- 0486US11284534B2Cooling deviceSUMITOMO PRECISION PROD CO·Filed 2017·Granted Mar 22, 2022·5 cites·10 claims
- 0581US8813832B2Heat sinkMIKI KEIJI·Filed 2010·Granted Aug 26, 2014·8 cites·12 claims
- 0680US8022508B2Semiconductor waferPANASONIC CORP·Filed 2007·Granted Sep 20, 2011·8 cites·13 claims
- 0779US7728429B2Semiconductor device having recessed connector portionsPANASONIC CORP·Filed 2007·Granted Jun 1, 2010·9 cites·24 claims
- 0872US6784557B2Semiconductor device including a diffusion layer formed between electrode portionsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 31, 2004·16 cites·8 claims
- 0968US6921583B2Al-Cu bonded structure and method for making the sameSUMITOMO PRECISION PROD CO·Filed 2004·Granted Jul 26, 2005·5 cites·14 claims
- 1063US11754344B2Boiling coolerSUMITOMO PRECISION PROD CO·Filed 2018·Granted Sep 12, 2023·1 cites·6 claims
- 1155US5162279AImmobilized metal complexesAGENCY IND SCIENCE TECHN·Filed 1991·Granted Nov 10, 1992·15 cites·15 claims
- 1249US6954001B2Semiconductor device including a diffusion layerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Oct 11, 2005·3 cites·18 claims
- 1346US8330255B2Semiconductor chipMIKI KEIJI·Filed 2011·Granted Dec 11, 2012·0 cites·10 claims
- 1441US6159622AGalvannealed steel sheet and manufacturing method thereofSUMITOMO METAL IND·Filed 1997·Granted Dec 12, 2000·9 cites·17 claims
- 1538US2011241178A1Semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2011·Application pending·0 cites
- 1636US2011278722A1Semiconductor device and manufacturing method thereofMIKI KEIJI·Filed 2011·Application pending·0 cites
- 1733US11940222B2Heat sink module with through-holeSUMITOMO PRECISION PROD CO·Filed 2017·Granted Mar 26, 2024·0 cites·6 claims
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