Inventor

GRIEF MALCOLM K

US9 patents

⚠️ This page may combine multiple inventors who share the name “GRIEF MALCOLM K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PHILIPS CORP

2 patents

US4936950AJun 26, 1990

Method of forming a configuration of interconnections on a semiconductor device having a high integration density

PHILIPS CORP54 citations94

USRE34583EApr 12, 1994

Method of forming a configuration of interconnections on a semiconductor device having a high integration density

PHILIPS CORP10 citations69

MEDTRONIC INC

2 patents

US9318400B2Apr 19, 2016

Wafer-scale package including power source

MEDTRONIC INC2 citations62

US9431312B2Aug 30, 2016

Wafer-scale package including power source

MEDTRONIC INC0 citations51

MICRON TECHNOLOGY INC

1 patent

US5738562AApr 14, 1998

Apparatus and method for planar end-point detection during chemical-mechanical polishing

MICRON TECHNOLOGY INC149 citations98

O'BRIEN RICHARD J

1 patent

US8666505B2Mar 4, 2014

Wafer-scale package including power source

O'BRIEN RICHARD J50 citations96

GRIEF MALCOLM K

1 patent

US5136362AAug 4, 1992

Electrical contact with diffusion barrier

GRIEF MALCOLM K54 citations89

SPEEDFAM CORP

1 patent

US6555466B1Apr 29, 2003

Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers

SPEEDFAM CORP17 citations82

SPEEDFAM IPEC CORP

1 patent

US6387188B1May 14, 2002

Pad conditioning for copper-based semiconductor wafers

SPEEDFAM IPEC CORP5 citations60