Inventor
JEON CHANG-SEONG
KR10 patents
⚠️ This page may combine multiple inventors who share the name “JEON CHANG-SEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
5 patentsUS9177942B2Nov 3, 2015
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD9 citations82
US9136260B2Sep 15, 2015
Method of manufacturing chip-stacked semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations61
US10867857B2Dec 15, 2020
Method of cutting substrate and method of singulating semiconductor chips
SAMSUNG ELECTRONICS CO LTD1 citations59
US9082871B2Jul 14, 2015
Substrate of semiconductor package and method of fabricating semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US8987904B2Mar 24, 2015
Substrate of semiconductor package and method of fabricating semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD0 citations49
JEON CHANG-SEONG
2 patentsUS9245787B2Jan 26, 2016
Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same
JEON CHANG-SEONG10 citations80
US8697494B2Apr 15, 2014
Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method
JEON CHANG-SEONG5 citations70