Inventor

CHO TAEJE

KR22 patents

⚠️ This page may combine multiple inventors who share the name “CHO TAEJE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHO TAEJE

SAMSUNG ELECTRONICS CO LTD

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

Semiconductor packages having through electrodes and methods for fabricating the same

Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same

Semiconductor package and method of fabricating the same

Semiconductor device

Stacked-chip packages

Stacked-chip packages having through vias

Method of manufacturing semiconductor device substrate with crystal structure reformation regions

Semiconductor package and method of fabricating the same

Semiconductor package and manufacturing method thereof

Semiconductor devices having through-electrodes and methods for fabricating the same

LEE GO EUN

Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip

KWON WOONSEONG

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

KANG UN BYOUNG

Method of fabricating a semiconductor device

JANG HYE-YOUNG

Semiconductor packages and methods for fabricating the same

IM YUNHYEOK

Semiconductor packages

HAN SANG UK

Semiconductor package and method of fabricating the same

RYU SEUNG KWAN

Semiconductor package and method of fabricating the same

JEONG SEYOUNG

Methods of fabricating semiconductor devices

SEO SUNKYOUNG

Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line

HEO JUNYEONG

Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same

HONG JISUN

Method for wafer level package and semiconductor device fabricated using the same