Inventor
TEOH HOAY TIEN
MY13 patents
⚠️ This page may combine multiple inventors who share the name “TEOH HOAY TIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS9972589B1May 15, 2018
Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer
INTEL CORP47 citations93
US10411001B2Sep 10, 2019
Dynamic random access memory (DRAM) mounts
INTEL CORP2 citations72
US9613920B2Apr 4, 2017
Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias
INTEL CORP2 citations72
US11696409B2Jul 4, 2023
Vertical embedded component in a printed circuit board blind hole
INTEL CORP0 citations61
US12500155B2Dec 16, 2025
Electronic package with passive component between substrates
INTEL CORP0 citations60
US11264315B2Mar 1, 2022
Electronic package with passive component between substrates
INTEL CORP1 citations60
US10861839B2Dec 8, 2020
Dynamic random access memory (DRAM) mounts
INTEL CORP0 citations51
US10163777B2Dec 25, 2018
Interconnects for semiconductor packages
INTEL CORP0 citations51
US9907170B2Feb 27, 2018
FPC connector for better signal integrity and design compaction
INTEL CORP0 citations51
US10492299B2Nov 26, 2019
Electronic assembly that includes a substrate bridge
INTEL CORP0 citations50
US9960224B2May 1, 2018
Three capacitor stack and associated methods
INTEL CORP0 citations50
US10785872B2Sep 22, 2020
Package jumper interconnect
INTEL CORP0 citations41