Inventor
KUBOTA KENJI
JP59 patents
⚠️ This page may combine multiple inventors who share the name “KUBOTA KENJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI MATERIALS CORP
19 patentsUS8940404B2Jan 27, 2015
Tin-plated copper-alloy material for terminal and method for producing the same
MITSUBISHI MATERIALS CORP5 citations69
US11753733B2Sep 12, 2023
Method for producing high-purity electrolytic copper
MITSUBISHI MATERIALS CORP0 citations62
US11453953B2Sep 27, 2022
High-purity electrolytic copper
MITSUBISHI MATERIALS CORP0 citations62
US11901659B2Feb 13, 2024
Terminal material for connectors
MITSUBISHI MATERIALS CORP0 citations61
US11761109B2Sep 19, 2023
Terminal material for connector
MITSUBISHI MATERIALS CORP0 citations61
US11264750B2Mar 1, 2022
Tin-plated copper terminal material, terminal, and electric-wire terminal structure
MITSUBISHI MATERIALS CORP0 citations61
US11088472B2Aug 10, 2021
Tin-plated copper terminal material, terminal, and wire terminal part structure
MITSUBISHI MATERIALS CORP0 citations61
US10910130B2Feb 2, 2021
Corrosion-resistant terminal material, corrosion-resistant terminal, and wire-end structure
MITSUBISHI MATERIALS CORP0 citations61
US10858750B2Dec 8, 2020
Tin-plated copper terminal material, terminal and electric wire terminal-end structure
MITSUBISHI MATERIALS CORP1 citations61
US10407785B2Sep 10, 2019
Additive for high-purity copper electrolytic refining and method of producing high-purity copper
MITSUBISHI MATERIALS CORP1 citations61
US11781234B2Oct 10, 2023
Copper alloy plate, plating film-attached copper alloy plate, and methods respectively for manufacturing these products
MITSUBISHI MATERIALS CORP0 citations59
US11530490B2Dec 20, 2022
Terminal material with silver coating film and terminal with silver coating film
MITSUBISHI MATERIALS CORP0 citations59
US12137526B2Nov 5, 2024
Bonded body and insulating circuit board
MITSUBISHI MATERIALS CORP0 citations56
US11211729B2Dec 28, 2021
Terminal material for connectors, terminal, and electric wire termination structure
MITSUBISHI MATERIALS CORP0 citations51
US10801115B2Oct 13, 2020
Tinned copper terminal material, terminal, and electrical wire end part structure
MITSUBISHI MATERIALS CORP0 citations51
US10793956B2Oct 6, 2020
Additive for high-purity copper electrolytic refining and method of producing high-purity copper
MITSUBISHI MATERIALS CORP0 citations51
US10428434B2Oct 1, 2019
Additive for high-purity copper electrolytic refining, method of producing high-purity copper, and high-purity electrolytic copper
MITSUBISHI MATERIALS CORP0 citations51
US10358730B2Jul 23, 2019
Additive for high-purity copper electrolytic refining and method of producing high-purity copper
MITSUBISHI MATERIALS CORP0 citations51
US10301737B2May 28, 2019
Method of manufacturing tin-plated copper terminal material
MITSUBISHI MATERIALS CORP0 citations51
MURATA MANUFACTURING CO
11 patentsUS5644107AJul 1, 1997
Method of manufacturing a multilayer electronic component
MURATA MANUFACTURING CO44 citations96
US5635670AJun 3, 1997
Multilayer electronic component
MURATA MANUFACTURING CO59 citations96
US5635669AJun 3, 1997
Multilayer electronic component
MURATA MANUFACTURING CO59 citations96
US5625935AMay 6, 1997
Method of manufacturing a multilayer electronic component
MURATA MANUFACTURING CO40 citations96
US5604328AFeb 18, 1997
Multilayer electronic component
MURATA MANUFACTURING CO33 citations96
US5488765AFeb 6, 1996
Method of measuring characteristics of a multilayer electronic component
MURATA MANUFACTURING CO65 citations96
US5493769AFeb 27, 1996
Method of manufacturing electronic component and measuring characteristics of same
MURATA MANUFACTURING CO53 citations93
US6507139B1Jan 14, 2003
Apparatus having an electronic component located on a surface of a package member with a space therebetween
MURATA MANUFACTURING CO28 citations92
US6871388B2Mar 29, 2005
Method of forming an electronic component located on a surface of a package member with a space therebetween
MURATA MANUFACTURING CO8 citations74
US6861588B2Mar 1, 2005
Laminated ceramic electronic component and method of producing the same
MURATA MANUFACTURING CO8 citations73
US10021787B2Jul 10, 2018
Resin substrate combined structure
MURATA MANUFACTURING CO0 citations52
MAZDA MOTOR
6 patentsUS6002373ADec 14, 1999
Glass window antenna
MAZDA MOTOR25 citations92
US5952977ASep 14, 1999
Glass antenna
MAZDA MOTOR33 citations92
US5659324AAug 19, 1997
Glass antenna and method of designing the same
MAZDA MOTOR24 citations92
US6008767ADec 28, 1999
Glass antenna having a shape to provide maximum reception sensitivity while not blocking a driver's sight
MAZDA MOTOR17 citations84
US5793333AAug 11, 1998
Glass antenna for vehicles, and designing method of the same
MAZDA MOTOR9 citations73
US6018322AJan 25, 2000
Earth structure for antennas, and antenna apparatus with earth for vehicles
MAZDA MOTOR5 citations62
KURARAY CO
2 patentsHITACHI LTD
2 patentsUS5335327AAug 2, 1994
External memory control techniques with multiprocessors improving the throughput of data between a hierarchically upper processing unit and an external memory with efficient use of a cache memory
HITACHI LTD44 citations91
US5241640AAug 31, 1993
Disk unit with processors which detect cache status and control port selection for optimizing utilization of cache interfacing host and external memory
HITACHI LTD11 citations72
VICTOR COMPANY OF JAPAN
2 patentsSANYO ELECTRIC CO
2 patentsKUBOTA KK
1 patentDEXERIALS CORP
1 patentJAPAN HIGHWAY PUBLIC CORP
1 patentMITSUBISHI SHINDO KK
1 patentKIDA SHINGO
1 patentNEC CORP
1 patentShowing the top 50 of 59 patents by PatentIndex Score.