P

Inventor

NAKAYA KIYOTAKA

JP26 patents
⚠️ This page may combine multiple inventors who share the name “NAKAYA KIYOTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI MATERIALS CORP

25 patents
US10047448B2Aug 14, 2018

Tin-plated copper-alloy terminal material

MITSUBISHI MATERIALS CORP2 citations73
US11753733B2Sep 12, 2023

Method for producing high-purity electrolytic copper

MITSUBISHI MATERIALS CORP0 citations62
US11453953B2Sep 27, 2022

High-purity electrolytic copper

MITSUBISHI MATERIALS CORP0 citations62
US11264750B2Mar 1, 2022

Tin-plated copper terminal material, terminal, and electric-wire terminal structure

MITSUBISHI MATERIALS CORP0 citations61
US11088472B2Aug 10, 2021

Tin-plated copper terminal material, terminal, and wire terminal part structure

MITSUBISHI MATERIALS CORP0 citations61
US10910130B2Feb 2, 2021

Corrosion-resistant terminal material, corrosion-resistant terminal, and wire-end structure

MITSUBISHI MATERIALS CORP0 citations61
US10858750B2Dec 8, 2020

Tin-plated copper terminal material, terminal and electric wire terminal-end structure

MITSUBISHI MATERIALS CORP1 citations61
US10407785B2Sep 10, 2019

Additive for high-purity copper electrolytic refining and method of producing high-purity copper

MITSUBISHI MATERIALS CORP1 citations61
US11530490B2Dec 20, 2022

Terminal material with silver coating film and terminal with silver coating film

MITSUBISHI MATERIALS CORP0 citations59
US12226820B2Feb 18, 2025

Bonding sheet

MITSUBISHI MATERIALS CORP0 citations54
US11211729B2Dec 28, 2021

Terminal material for connectors, terminal, and electric wire termination structure

MITSUBISHI MATERIALS CORP0 citations51
US10801115B2Oct 13, 2020

Tinned copper terminal material, terminal, and electrical wire end part structure

MITSUBISHI MATERIALS CORP0 citations51
US10793956B2Oct 6, 2020

Additive for high-purity copper electrolytic refining and method of producing high-purity copper

MITSUBISHI MATERIALS CORP0 citations51
US10428434B2Oct 1, 2019

Additive for high-purity copper electrolytic refining, method of producing high-purity copper, and high-purity electrolytic copper

MITSUBISHI MATERIALS CORP0 citations51
US10358730B2Jul 23, 2019

Additive for high-purity copper electrolytic refining and method of producing high-purity copper

MITSUBISHI MATERIALS CORP0 citations51
US10301737B2May 28, 2019

Method of manufacturing tin-plated copper terminal material

MITSUBISHI MATERIALS CORP0 citations51
US11661667B2May 30, 2023

Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structure

MITSUBISHI MATERIALS CORP0 citations50
US11572633B2Feb 7, 2023

Tin-plated copper terminal material and method of manufacturing the same

MITSUBISHI MATERIALS CORP0 citations48
US10450665B2Oct 22, 2019

Plating solution using ammonium salt

MITSUBISHI MATERIALS CORP0 citations48
US10329680B2Jun 25, 2019

Plating solution using sulfonium salt

MITSUBISHI MATERIALS CORP0 citations48
US10174434B2Jan 8, 2019

Plating solution using phosphonium salt

MITSUBISHI MATERIALS CORP0 citations48
US11174565B2Nov 16, 2021

Plating liquid

MITSUBISHI MATERIALS CORP0 citations47
US11268203B2Mar 8, 2022

Tin or tin alloy plating solution

MITSUBISHI MATERIALS CORP0 citations44
US11162182B2Nov 2, 2021

Tin or tin alloy plating solution

MITSUBISHI MATERIALS CORP0 citations44
US9783904B2Oct 10, 2017

High-purity electrolytic copper and electrolytic refining method thereof

MITSUBISHI MATERIALS CORP0 citations39

MITSUBISHI SHINDO KK

1 patent