Inventor
WANG RONGPING
US22 patents
⚠️ This page may combine multiple inventors who share the name “WANG RONGPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
16 patentsUS9240308B2Jan 19, 2016
Hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system
APPLIED MATERIALS INC17 citations92
US9378928B2Jun 28, 2016
Apparatus for treating a gas in a conduit
APPLIED MATERIALS INC15 citations90
US9552967B2Jan 24, 2017
Abatement system having a plasma source
APPLIED MATERIALS INC7 citations83
US9230780B2Jan 5, 2016
Hall effect enhanced capacitively coupled plasma source
APPLIED MATERIALS INC14 citations83
US9767990B2Sep 19, 2017
Apparatus for treating a gas in a conduit
APPLIED MATERIALS INC9 citations82
US10187966B2Jan 22, 2019
Method and apparatus for gas abatement
APPLIED MATERIALS INC8 citations81
US11398369B2Jul 26, 2022
Method and apparatus for actively tuning a plasma power source
APPLIED MATERIALS INC2 citations73
US9543124B2Jan 10, 2017
Capacitively coupled plasma source for abating compounds produced in semiconductor processes
APPLIED MATERIALS INC4 citations72
US10580626B2Mar 3, 2020
Arcing detection apparatus for plasma processing
APPLIED MATERIALS INC1 citations62
US8728918B2May 20, 2014
Method and apparatus for fabricating silicon heterojunction solar cells
APPLIED MATERIALS INC3 citations62
US7571698B2Aug 11, 2009
Low-frequency bias power in HDP-CVD processes
APPLIED MATERIALS INC4 citations61
US11328900B2May 10, 2022
Plasma ignition circuit
APPLIED MATERIALS INC0 citations60
US10757797B2Aug 25, 2020
Method and apparatus for gas abatement
APPLIED MATERIALS INC1 citations60
US11355325B2Jun 7, 2022
Methods and systems for monitoring input power for process control in semiconductor process systems
APPLIED MATERIALS INC0 citations59
US10176973B2Jan 8, 2019
Method of cooling a composition using a hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system
APPLIED MATERIALS INC0 citations51
US10211030B2Feb 19, 2019
Source RF power split inner coil to improve BCD and etch depth performance
APPLIED MATERIALS INC0 citations30