Inventor
KIM SANGSOO
CN32 patents
⚠️ This page may combine multiple inventors who share the name “KIM SANGSOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
15 patentsUS5240868AAug 31, 1993
Method of fabrication metal-electrode in semiconductor device
SAMSUNG ELECTRONICS CO LTD44 citations92
US10361177B2Jul 23, 2019
Semiconductor package having a molding layer including a molding cavity and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations72
US11107769B2Aug 31, 2021
Semiconductor package and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations70
US11101243B2Aug 24, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations70
US11469156B2Oct 11, 2022
Semiconductor package for discharging heat generated by semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations62
US10978374B2Apr 13, 2021
Semiconductor package for discharging heat generated by semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations62
US11996365B2May 28, 2024
Semiconductor package and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11610845B2Mar 21, 2023
Semiconductor package and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11742329B2Aug 29, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11508713B2Nov 22, 2022
Methods of manufacturing semiconductor package and package-on-package
SAMSUNG ELECTRONICS CO LTD0 citations59
US5306668AApr 26, 1994
Method of fabricating metal-electrode in semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations56
US11569209B2Jan 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations54
US12438134B2Oct 7, 2025
Package substrate and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11728142B2Aug 15, 2023
Apparatus for conducting plasma surface treatment, board treatment system having the same
SAMSUNG ELECTRONICS CO LTD0 citations46
US12463122B2Nov 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations44
AMERICAN MESSAGING SERVICES LLC
7 patentsUS12309630B2May 20, 2025
Messaging devices and methods
AMERICAN MESSAGING SERVICES LLC0 citations60
US11412402B2Aug 9, 2022
Messaging devices and methods
AMERICAN MESSAGING SERVICES LLC0 citations60
US10681581B2Jun 9, 2020
Messaging devices and methods
AMERICAN MESSAGING SERVICES LLC0 citations49
US10051505B2Aug 14, 2018
Messaging devices and methods
AMERICAN MESSAGING SERVICES LLC0 citations49
US9743308B2Aug 22, 2017
Messaging devices and methods
AMERICAN MESSAGING SERVICES LLC0 citations49
US8841989B2Sep 23, 2014
Messaging devices and methods
AMERICAN MESSAGING SERVICES LLC0 citations49
US9608680B2Mar 28, 2017
Messaging devices and methods
AMERICAN MESSAGING SERVICES LLC0 citations46