Inventor

DAYCOCK DAVID A

SG23 patents

⚠️ This page may combine multiple inventors who share the name “DAYCOCK DAVID A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAYCOCK DAVID A

MICRON TECHNOLOGY INC

Methods for fabricating microelectronic devices with contacts to conductive staircase steps, and related devices and systems

Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems

Forming terminations in stacked memory arrays

Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems

Formation of termination structures in stacked memory arrays

Forming terminations in stacked memory arrays

Formation of termination structures in stacked memory arrays

Semiconductor device structures with liners

Methods of forming semiconductor device structures, memory cells, and arrays

Memory devices including strings of memory cells and related systems

Bond pad connection layout

Methods of forming electronic devices, and related electronic devices

Bond pad connection layout

Methods for fabricating microelectronic devices with contacts to conductive staircase steps, and related devices and systems

INTEL CORP

Solid state memory component

Solid state memory component

Solid state memory component

Computer memory

3D NAND with integral drain-end select gate (SGD)

LODESTAR LICENSING GROUP LLC

Microelectronic devices including pillars with partially-circular upper portions and circular lower portions, and related methods

Bond pad connection layout

DAYCOCK DAVID A

Method of reducing damage to an electron beam inspected semiconductor substrate, and methods of inspecting a semiconductor substrate

Method of reducing electron beam damage on post W-CMP wafers