Inventor
TIWARI CHANDRA S
US16 patents
⚠️ This page may combine multiple inventors who share the name “TIWARI CHANDRA S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
15 patentsUS10002840B1Jun 19, 2018
Semiconductor devices having discretely located passivation material, and associated systems and methods
MICRON TECHNOLOGY INC3 citations70
US12069856B2Aug 20, 2024
Methods of forming electronic devices using materials removable at different temperatures
MICRON TECHNOLOGY INC0 citations62
US11800717B2Oct 24, 2023
Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems
MICRON TECHNOLOGY INC0 citations62
US11476268B2Oct 18, 2022
Methods of forming electronic devices using materials removable at different temperatures
MICRON TECHNOLOGY INC0 citations62
US11322516B2May 3, 2022
Microelectronic devices including isolation structures protruding into upper pillar portions, and related methods and systems
MICRON TECHNOLOGY INC0 citations62
US12205900B2Jan 21, 2025
Electronic devices comprising a compressive dielectric material, and related systems and methods
MICRON TECHNOLOGY INC0 citations60
US11094684B2Aug 17, 2021
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
MICRON TECHNOLOGY INC0 citations60
US11402426B2Aug 2, 2022
Inductive testing probe apparatus for testing semiconductor die and related systems and methods
MICRON TECHNOLOGY INC0 citations59
US11276658B2Mar 15, 2022
Devices with three-dimensional structures and support elements to increase adhesion to substrates
MICRON TECHNOLOGY INC0 citations59
US10896886B2Jan 19, 2021
Semiconductor devices having discretely located passivation material, and associated systems and methods
MICRON TECHNOLOGY INC0 citations59
US10790251B2Sep 29, 2020
Methods for enhancing adhesion of three-dimensional structures to substrates
MICRON TECHNOLOGY INC1 citations59
US12406886B2Sep 2, 2025
Microelectronic devices including slot structures, and related electronic systems and methods of forming the microelectronic devices
MICRON TECHNOLOGY INC0 citations49
US10852344B2Dec 1, 2020
Inductive testing probe apparatus for testing semiconductor die and related systems and methods
MICRON TECHNOLOGY INC0 citations49
US10403618B2Sep 3, 2019
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
MICRON TECHNOLOGY INC0 citations49
US10262961B2Apr 16, 2019
Semiconductor devices having discretely located passivation material, and associated systems and methods
MICRON TECHNOLOGY INC0 citations49