Inventor
PARK JUMYONG
KR22 patents
Patents
22 patentsUS9070748B2Jun 30, 2015
Semiconductor devices having through-vias and methods for fabricating the same
SAMSUNG ELECTRONICS CO LTD10 citations84
US11996358B2May 28, 2024
Semiconductor packages having first and second redistribution patterns
SAMSUNG ELECTRONICS CO LTD2 citations72
US9502274B2Nov 22, 2016
Wafer loaders having buffer zones
SAMSUNG ELECTRONICS CO LTD3 citations72
US11476176B2Oct 18, 2022
Semiconductor device having via protective layer
SAMSUNG ELECTRONICS CO LTD2 citations70
US12512427B2Dec 30, 2025
Semiconductor device including lower pads having different widths and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US12368093B2Jul 22, 2025
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations62
US12593702B2Mar 31, 2026
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12476180B2Nov 18, 2025
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12347760B2Jul 1, 2025
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12027482B2Jul 2, 2024
Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations61
US11923309B2Mar 5, 2024
Semiconductor package including fine redistribution patterns
SAMSUNG ELECTRONICS CO LTD0 citations61
US11798872B2Oct 24, 2023
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11637058B2Apr 25, 2023
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12224256B2Feb 11, 2025
Wafer structure and semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations60
US12199056B2Jan 14, 2025
Semiconductor device, semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11978688B2May 7, 2024
Semiconductor device having via protective layer
SAMSUNG ELECTRONICS CO LTD0 citations60
US11854893B2Dec 26, 2023
Method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US12451474B2Oct 21, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12417990B2Sep 16, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12009288B2Jun 11, 2024
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12142541B2Nov 12, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US12021034B2Jun 25, 2024
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49