Inventor

JIN JEONGGI

KR29 patents

⚠️ This page may combine multiple inventors who share the name “JIN JEONGGI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JIN JEONGGI

SAMSUNG ELECTRONICS CO LTD

Semiconductor package

Electrical interconnection structures including stress buffer layers

Electronic device having a redistribution area

Semiconductor devices and semiconductor packages including the same

Semiconductor packages having first and second redistribution patterns

Semiconductor device

Semiconductor device having via protective layer

Semiconductor packages

Semiconductor devices and semiconductor packages including the same

Semiconductor devices and semiconductor packages including the same

Interconnection structure and semiconductor package including the same

Interconnection structure and semiconductor package including the same

Semiconductor package

Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip

Interconnection structure and semiconductor package including the same

Interconnection structure and semiconductor package including the same

Semiconductor device having via protective layer

Semiconductor device

Semiconductor device

Semiconductor package

Electrical interconnections of semiconductor devices and methods for fabricating the same

Semiconductor package

Semiconductor package

Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same

Semiconductor package

Semiconductor package and method of manufacturing the semiconductor package

Semiconductor devices and methods of manufacturing the same

KANG PIL-KYU

Semiconductor devices having through-electrodes and methods for fabricating the same

JIN JEONGGI

Semiconductor devices having through electrodes capped with self-aligned protection layers