Inventor
CHUN JINHO
KR11 patents
Patents
11 patentsUS9530706B2Dec 27, 2016
Semiconductor devices having hybrid stacking structures and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD13 citations83
US9799619B2Oct 24, 2017
Electronic device having a redistribution area
SAMSUNG ELECTRONICS CO LTD9 citations82
US11996358B2May 28, 2024
Semiconductor packages having first and second redistribution patterns
SAMSUNG ELECTRONICS CO LTD2 citations72
US11538783B2Dec 27, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations70
US11476176B2Oct 18, 2022
Semiconductor device having via protective layer
SAMSUNG ELECTRONICS CO LTD2 citations70
US12368093B2Jul 22, 2025
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations62
US11978688B2May 7, 2024
Semiconductor device having via protective layer
SAMSUNG ELECTRONICS CO LTD0 citations60
US12354987B2Jul 8, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US11984420B2May 14, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US11444014B2Sep 13, 2022
Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12142541B2Nov 12, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49