Inventor

YONEZAWA TOSHIO

JP57 patents

⚠️ This page may combine multiple inventors who share the name “YONEZAWA TOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YONEZAWA TOSHIO

TOKYO SHIBAURA ELECTRIC CO

Semiconductor memory device

Semiconductor device

Method for forming metallization structure having flat surface on semiconductor substrate

Method of producing semiconductor device

Method of dicing a semiconductor wafer

Semiconductor device with an improved bonding section

Semiconductor device with selective nitride layer over channel stop

Semiconductor device and a method for manufacturing the same

Method of manufacturing semiconductor device utilizing outdiffusion and epitaxial deposition

Semiconductor device monolithically comprising a V-MOSFET and bipolar transistor isolated from each other

Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat

Method of manufacturing a semiconductor device using silicon carbide mask

Method of manufacturing a semiconductor device using epitaxially regrown protrusion as an alignment marker

System for etching a metal film on a semiconductor wafer

Method of making transistors by ion implantations, electron beam irradiation and thermal annealing

NPN transistor with base double doped with arsenic and boron

Semiconductor device and method for manufacturing the same

Semiconductor device with multi-layered structure

Fabrication of transistors having specifically paired dopants

Fluorine-doped P type silicon

Method of manufacturing a semiconductor device

Method of making integrated devices having long and short minority carrier lifetimes

Semiconductor device with thermally compensating SiO2 -silicate glass-SiC passivation layer

Method of producing semiconductor device

Method of manufacturing a semiconductor device

Method of producing a P-N junction utilizing polycrystalline silicon

Apparatus for producing a semiconductor device

Method of forming reproducible impurity zone of gallium or aluminum in a wafer by implanting through composite layers and diffusion annealing

Semiconductor device with multi-layered metalizations

Method for forming resist pattern

MITSUBISHI HEAVY IND LTD

Ni-based alloy and method for preparing same

Spray coating powder material and high-temperature components coated therewith

Austenitic stainless steel resistant to neutron-irradiation-induced deterioration and method of making thereof

Fe-cr-ni-si shape memory alloys with excellent stress corrosion cracking resistance

Nickel-chromium alloy in stress corrosion cracking resistance

High-nickel austenitic stainless steel resistant to degradation by neutron irradiation

TOSHIBA KK

Semiconductor device having a multilayer wiring structure using a polyimide resin

Product design process and product design apparatus

Method of manufacturing a bipolar transistor

PETOCA LTD

Carbon fibers for reinforcement of cement and cement composite material

Carbon fiber rovings for reinforcement of concrete

Carbon fibers for reinforcement of cement and cement composite material

TAKEMOTO OIL & FAT CO LTD

High-strength hydraulic cement compositions

Ultra high-strength hydraulic cement compositions

TAKENAKA CORP

Ultra high-strength hydraulic cement compositions

KEIHIN RYOKO CONCRETE IND CORP

Apparatus for feeding ultrafine powder in quantitative batch operation

KONO TAKAO

Method of producing soil cement slurry

KANTO KAGAKU

Negative-working photoresist coating composition

MITSUBISHI METAL CORP

Precipitation hardening nickel base single crystal cast alloy

TAKAHASHI KOUICHI

Method of reducing emitter dip in transistors utilizing specifically paired dopants