Inventor
TAKASAGO HAYATO
JP26 patents
Patents
26 patentsUS5113274AMay 12, 1992
Matrix-type color liquid crystal display device
MITSUBISHI ELECTRIC CORP240 citations99
US4993148AFeb 19, 1991
Method of manufacturing a circuit board
MITSUBISHI ELECTRIC CORP148 citations99
US6104464AAug 15, 2000
Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board
MITSUBISHI ELECTRIC CORP110 citations96
US5173844ADec 22, 1992
Integrated circuit device having a metal substrate
MITSUBISHI ELECTRIC CORP68 citations96
US5081562AJan 14, 1992
Circuit board with high heat dissipations characteristic
MITSUBISHI ELECTRIC CORP53 citations96
US4914815AApr 10, 1990
Method for manufacturing hybrid integrated circuits
MITSUBISHI ELECTRIC CORP101 citations96
US5029984AJul 9, 1991
Liquid crystal display device
MITSUBISHI ELECTRIC CORP69 citations95
US4967261AOct 30, 1990
Tape carrier for assembling an IC chip on a substrate
MITSUBISHI ELECTRIC CORP86 citations95
US4942140AJul 17, 1990
Method of packaging semiconductor device
MITSUBISHI ELECTRIC CORP103 citations93
US5269868ADec 14, 1993
Method for separating bonded substrates, in particular disassembling a liquid crystal display device
MITSUBISHI ELECTRIC CORP48 citations92
US4854230AAug 8, 1989
Screen printing apparatus
MITSUBISHI ELECTRIC CORP28 citations92
US4643798AFeb 17, 1987
Composite and circuit board having conductive layer on resin layer and method of manufacturing
MITSUBISHI ELECTRIC CORP33 citations92
US4629681ADec 16, 1986
Method of manufacturing multilayer circuit board
MITSUBISHI ELECTRIC CORP31 citations92
US5293262AMar 8, 1994
Liquid crystal display device having heat-insulating members and driving circuit boards attached to rear edges of light box
MITSUBISHI ELECTRIC CORP55 citations91
US5604513AFeb 18, 1997
Serial sampling video signal driving apparatus with improved color rendition
MITSUBISHI ELECTRIC CORP43 citations89
US4943768AJul 24, 1990
Testing device for electrical circuit boards
MITSUBISHI ELECTRIC CORP25 citations89
US4685203AAug 11, 1987
Hybrid integrated circuit substrate and method of manufacturing the same
MITSUBISHI ELECTRIC CORP22 citations82
US4645734AFeb 24, 1987
Composite having conductive layer on resin layer and method of manufacturing
MITSUBISHI ELECTRIC CORP9 citations74
US4946709AAug 7, 1990
Method for fabricating hybrid integrated circuit
MITSUBISHI ELECTRIC CORP9 citations73
US4785157ANov 15, 1988
Method for controlling electric resistance of a compound-type resistors
MITSUBISHI ELECTRIC CORP12 citations73
US4783642ANov 8, 1988
Hybrid integrated circuit substrate and method of manufacturing the same
MITSUBISHI ELECTRIC CORP14 citations73
US5034569AJul 23, 1991
Multilayer interconnection circuit board
MITSUBISHI ELECTRIC CORP9 citations72
US4963389AOct 16, 1990
Method for producing hybrid integrated circuit substrate
MITSUBISHI ELECTRIC CORP12 citations69
US4898805AFeb 6, 1990
Method for fabricating hybrid integrated circuit
MITSUBISHI ELECTRIC CORP6 citations61
US5069745ADec 3, 1991
Process for preparing a combined wiring substrate
MITSUBISHI ELECTRIC CORP4 citations60
US4887030ADec 12, 1989
Testing device for electrical circuit boards
MITSUBISHI ELECTRIC CORP4 citations60