Inventor
CHEN YING-CHIH
US48 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YING-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEGICA CORP
7 patentsUS7521812B2Apr 21, 2009
Method of wire bonding over active area of a semiconductor circuit
MEGICA CORP37 citations96
US8026588B2Sep 27, 2011
Method of wire bonding over active area of a semiconductor circuit
MEGICA CORP10 citations93
US8021976B2Sep 20, 2011
Method of wire bonding over active area of a semiconductor circuit
MEGICA CORP15 citations93
US7973401B2Jul 5, 2011
Stacked chip package with redistribution lines
MEGICA CORP8 citations84
US7508059B2Mar 24, 2009
Stacked chip package with redistribution lines
MEGICA CORP12 citations84
US7592205B2Sep 22, 2009
Over-passivation process of forming polymer layer over IC chip
MEGICA CORP4 citations63
US7919412B2Apr 5, 2011
Over-passivation process of forming polymer layer over IC chip
MEGICA CORP0 citations42
MEDIATEK INC
6 patentsUS9818727B2Nov 14, 2017
Semiconductor package assembly with passive device
MEDIATEK INC2 citations72
US9129962B1Sep 8, 2015
Bonding pad arrangment design for multi-die semiconductor package structure
MEDIATEK INC3 citations62
US11244913B2Feb 8, 2022
Semiconductor package
MEDIATEK INC0 citations51
US10497678B2Dec 3, 2019
Semiconductor package assembly with passive device
MEDIATEK INC0 citations51
US9991227B2Jun 5, 2018
Bonding pad arrangement design for multi-die semiconductor package structure
MEDIATEK INC0 citations51
US9564395B2Feb 7, 2017
Bonding pad arrangment design for multi-die semiconductor package structure
MEDIATEK INC0 citations51
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS11621337B2Apr 4, 2023
Semiconductor device, ferroelectric capacitor and laminated structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US12040377B2Jul 16, 2024
Semiconductor device, ferroelectric capacitor and laminated structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12289893B2Apr 29, 2025
Semiconductor devices including FTJ structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12408413B2Sep 2, 2025
Semiconductor device, ferroelectric capacitor and laminated structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12336186B2Jun 17, 2025
Semiconductor devices having ferroelectric tunnel junction structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
IND TECH RES INST
5 patentsUS7630594B2Dec 8, 2009
Optical interconnection module
IND TECH RES INST9 citations82
US7295725B1Nov 13, 2007
Electro-optical circuit board
IND TECH RES INST8 citations71
US7577321B2Aug 18, 2009
Hybrid electro-optical circuit board and method for fabricating the same
IND TECH RES INST2 citations62
US7249896B2Jul 31, 2007
Array optical sub-assembly
IND TECH RES INST4 citations60
US7212702B1May 1, 2007
Optoelectric converting substrate
IND TECH RES INST3 citations57
LEE JIN-YUAN
4 patentsUS9142527B2Sep 22, 2015
Method of wire bonding over active area of a semiconductor circuit
LEE JIN-YUAN11 citations92
US9153555B2Oct 6, 2015
Method of wire bonding over active area of a semiconductor circuit
LEE JIN-YUAN5 citations84
US8138079B2Mar 20, 2012
Method of wire bonding over active area of a semiconductor circuit
LEE JIN-YUAN8 citations84
US8742580B2Jun 3, 2014
Method of wire bonding over active area of a semiconductor circuit
LEE JIN-YUAN0 citations52
HU SHAN AUTO PARTS INC
4 patentsUSD920218SMay 25, 2021
Tailgate handle camera mount
HU SHAN AUTO PARTS INC2 citations71
USD920217SMay 25, 2021
Tailgate handle camera mount
HU SHAN AUTO PARTS INC1 citations61
US11161477B2Nov 2, 2021
Door handle, vehicle lock control system including the same, and operation method of the vehicle lock control system
HU SHAN AUTO PARTS INC0 citations42
US10852624B2Dec 1, 2020
Camera device
HU SHAN AUTO PARTS INC0 citations32