Inventor
ZIAI SYRUS
US34 patents
⚠️ This page may combine multiple inventors who share the name “ZIAI SYRUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PSIQUANTUM CORP
14 patentsUS10897235B2Jan 19, 2021
Superconducting signal amplifier
PSIQUANTUM CORP43 citations98
US10454014B2Oct 22, 2019
Diode devices based on superconductivity
PSIQUANTUM CORP49 citations98
US10396733B2Aug 27, 2019
Superconducting signal amplifier
PSIQUANTUM CORP53 citations98
US10386229B2Aug 20, 2019
Gated superconducting photon detector
PSIQUANTUM CORP53 citations98
US11009387B2May 18, 2021
Superconducting nanowire single photon detector and method of fabrication thereof
PSIQUANTUM CORP40 citations96
US10247969B1Apr 2, 2019
Photon sources with multiple cavities for generation of individual photons
PSIQUANTUM CORP11 citations84
US12015383B2Jun 18, 2024
Superconducting signal amplifier
PSIQUANTUM CORP1 citations73
US10861734B2Dec 8, 2020
Diode devices based on superconductivity
PSIQUANTUM CORP2 citations73
US11441941B2Sep 13, 2022
Superconducting nanowire single photon detector and method of fabrication thereof
PSIQUANTUM CORP2 citations71
US12429717B2Sep 30, 2025
Photon sources with multiple cavities for generation of individual photons
PSIQUANTUM CORP0 citations62
US11502237B2Nov 15, 2022
Diode devices based on superconductivity
PSIQUANTUM CORP0 citations62
US11163180B2Nov 2, 2021
Photon sources with multiple cavities for generation of individual photons
PSIQUANTUM CORP0 citations62
US11029203B2Jun 8, 2021
Gated superconducting photon detector
PSIQUANTUM CORP0 citations62
US12264961B2Apr 1, 2025
Superconducting nanowire single photon detector and method of fabrication thereof
PSIQUANTUM CORP0 citations60
ELIYAN CORP
11 patentsUS11893242B1Feb 6, 2024
Multi-chip module (MCM) with multi-port unified memory
ELIYAN CORP17 citations94
US11855043B1Dec 26, 2023
Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
ELIYAN CORP19 citations94
US12314567B1May 27, 2025
Multi-chip module (MCM) with multi-port unified memory
ELIYAN CORP2 citations75
US12204759B1Jan 21, 2025
Multi-chip module (MCM) with multi-port unified memory
ELIYAN CORP2 citations75
US12204794B1Jan 21, 2025
Architecture for DRAM control optimization using simultaneous bidirectional memory interfaces
ELIYAN CORP4 citations74
US12438095B1Oct 7, 2025
Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
ELIYAN CORP1 citations64
US12248679B1Mar 11, 2025
Multi-chip module (MCM) with multi-port unified memory
ELIYAN CORP0 citations62
US12248413B1Mar 11, 2025
Universal memory interface utilizing die-to-die (D2D) interfaces between chiplets
ELIYAN CORP1 citations61
US12204468B1Jan 21, 2025
Universal memory interface with dynamic bidirectional data transfers
ELIYAN CORP0 citations58
US12525540B1Jan 13, 2026
Multi-chip module (MCM) with scalable high bandwidth memory
ELIYAN CORP0 citations50
US12182040B1Dec 31, 2024
Multi-chip module (MCM) with scalable high bandwidth memory
ELIYAN CORP0 citations50
QUALCOMM INC
4 patentsUS12289898B2Apr 29, 2025
Vertically integrated device stack including system on chip and power management integrated circuit
QUALCOMM INC1 citations64
US11671017B2Jun 6, 2023
Current balancing for voltage regulator units in field programmable arrays
QUALCOMM INC0 citations58
US11658577B2May 23, 2023
Power management integrated circuit with a field programmable array of voltage regulators
QUALCOMM INC0 citations58
US11881783B2Jan 23, 2024
Management of voltage regulator units in field programmable arrays
QUALCOMM INC0 citations47