Inventor

COLE JR HERBERT S

US31 patents

⚠️ This page may combine multiple inventors who share the name “COLE JR HERBERT S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COLE JR HERBERT S

GEN ELECTRIC

Multi-sublayer dielectric layers

Electroless deposition employing laser-patterned masking layer

High density interconnect structure including a spacer structure and a gap

Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG &#39;s

Method for improving the response time of a display device utilizing a twisted nematic liquid crystal composition

Dichroic liquid crystal composition with 4,4-bis (substituted naphthylazo)azobenzene dichroic dyes

Process for removing organic material in a patterned manner from an organic film

High temperature polyether imide compositions and method for making

High density interconnect with electroplated conductors

Power outage indicator

Red perylene dichroic dye containing liquid crystal formulations

Novel yellow azo dyes and dichroic liquid crystal compositions made therewith

Dichroic liquid crystal compositions

Liquid crystal display with dark characters on light background

Multi-colored liquid crystal displays

Liquid crystal compositions with novel tris-azo dichroic dyes

Dichroic liquid crystal compositions

Liquid crystal compositions with positive dielectric anisotropy

Nematic liquid crystal mixtures having homogeneous boundary conditions and method of making the same

Method of developing a self-developing resist

Area-selective metallization process

Surface alignment process for liquid crystal displays

Novel tris-azo dyes and liquid crystal compositions made therewith

Liquid crystal compositions

Dichroic liquid crystal compositions

Positive dielectric anisotropy liquid crystal compositions

Dichroic liquid crystal compositions containing anthraquinone-based dyes

Liquid crystal mixtures with selectively variable dielectric anisotropies

MARTIN MARIETTA CORP

Reconstructable interconnect structure for electronic circuits

Reworkable high density interconnect structure incorporating a release layer

Method for making an electronics module having air bridge protection without large area ablation

Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's