P

Inventor

LUPINSKI JOHN H

US25 patents
⚠️ This page may combine multiple inventors who share the name “LUPINSKI JOHN H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GEN ELECTRIC

22 patents
US4201837AMay 6, 1980

Bonded amorphous metal electromagnetic components

GEN ELECTRIC75 citations96
US5300812AApr 5, 1994

Plasticized polyetherimide adhesive composition and usage

GEN ELECTRIC53 citations95
US5534602AJul 9, 1996

High temperature polyether imide compositions and method for making

GEN ELECTRIC21 citations92
US5169911ADec 8, 1992

Heat curable blends of silicone polymide and epoxy resin

GEN ELECTRIC22 citations92
US5153251AOct 6, 1992

Flame retardant polycarbonate compositions

GEN ELECTRIC30 citations92
US5015675AMay 14, 1991

Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators

GEN ELECTRIC27 citations92
US4975319ADec 4, 1990

Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether

GEN ELECTRIC37 citations92
US4853423AAug 1, 1989

Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production

GEN ELECTRIC40 citations92
US5204395AApr 20, 1993

Flame retardant polyphenylene ether compositions

GEN ELECTRIC17 citations74
US4346136AAug 24, 1982

Bondable magnet wire comprising polyamide-imide coating containing residual solvent

GEN ELECTRIC14 citations74
US4188413AFeb 12, 1980

Electrostatic-fluidized bed coating of wire

GEN ELECTRIC13 citations74
US4100883AJul 18, 1978

Apparatus for electrostatic deposition on a running conductor

GEN ELECTRIC15 citations74
US5095053AMar 10, 1992

Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions

GEN ELECTRIC11 citations73
US5064882ANov 12, 1991

Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diarliodonium-hexafluoroantimonate salts and free radical generators

GEN ELECTRIC12 citations73
US4842800AJun 27, 1989

Method of encapsulating electronic devices

GEN ELECTRIC18 citations73
US4024046AMay 17, 1977

Method for making polyimide coated conductors in a continuous manner and products made thereby

GEN ELECTRIC8 citations69
US3974324AAug 10, 1976

Method for making polyimide coated conductors in a continuous manner and products made thereby

GEN ELECTRIC11 citations69
US4271783AJun 9, 1981

Apparatus for fluidized bed-electrostatic coating of indefinite length substrate

GEN ELECTRIC6 citations63
US5096771AMar 17, 1992

Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether

GEN ELECTRIC4 citations62
US5310933AMay 10, 1994

Method for preparing polyimides for use in electronic applications

GEN ELECTRIC3 citations61
US4065420ADec 27, 1977

Method for making aqueous polyimide electrocoating mixtures

GEN ELECTRIC3 citations59
US4257861AMar 24, 1981

Electrocoating compositions and electrocoating method

GEN ELECTRIC3 citations57

US ENERGY

2 patents

MARTIN MARIETTA CORP

1 patent