Inventor
SAENGER KATHERINE LYNN
US52 patents
⚠️ This page may combine multiple inventors who share the name “SAENGER KATHERINE LYNN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
48 patentsUS7923337B2Apr 12, 2011
Fin field effect transistor devices with self-aligned source and drain regions
IBM234 citations99
US7795677B2Sep 14, 2010
Nanowire field-effect transistors
IBM146 citations99
US6413852B1Jul 2, 2002
Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material
IBM264 citations99
US6140226AOct 31, 2000
Dual damascene processing for semiconductor chip interconnects
IBM363 citations99
US6448176B1Sep 10, 2002
Dual damascene processing for semiconductor chip interconnects
IBM102 citations98
US6265779B1Jul 24, 2001
Method and material for integration of fuorine-containing low-k dielectrics
IBM139 citations98
US6184121B1Feb 6, 2001
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM369 citations98
US6096590AAug 1, 2000
Scalable MOS field effect transistor
IBM184 citations98
US5869880AFeb 9, 1999
Structure and fabrication method for stackable, air-gap-containing low epsilon dielectric layers
IBM108 citations98
US5789320AAug 4, 1998
Plating of noble metal electrodes for DRAM and FRAM
IBM326 citations98
US6815329B2Nov 9, 2004
Multilayer interconnect structure containing air gaps and method for making
IBM105 citations97
US6577011B1Jun 10, 2003
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM86 citations97
US6346484B1Feb 12, 2002
Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structures
IBM80 citations97
US6172385B1Jan 9, 2001
Multilayer ferroelectric capacitor structure
IBM155 citations97
US6737725B2May 18, 2004
Multilevel interconnect structure containing air gaps and method for making
IBM70 citations96
US5825609AOct 20, 1998
Compound electrode stack capacitor
IBM58 citations96
US6740535B2May 25, 2004
Enhanced T-gate structure for modulation doped field effect transistors
IBM53 citations95
US6448655B1Sep 10, 2002
Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation
IBM50 citations95
US6030904AFeb 29, 2000
Stabilization of low-k carbon-based dielectrics
IBM53 citations93
US6017814AJan 25, 2000
Structure and fabrication method for stackable, air-gap-containing low epsilon dielectric layers
IBM21 citations93
US7098476B2Aug 29, 2006
Multilayer interconnect structure containing air gaps and method for making
IBM39 citations92
US6972440B2Dec 6, 2005
Enhanced T-gate structure for modulation doped field effect transistors
IBM19 citations92
US6759321B2Jul 6, 2004
Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation
IBM24 citations92
US6727174B1Apr 27, 2004
Method for fabricating a dual-diameter electrical conductor
IBM29 citations92
US6388285B1May 14, 2002
Feram cell with internal oxygen source and method of oxygen release
IBM30 citations92
US6333202B1Dec 25, 2001
Flip FERAM cell and method to form same
IBM27 citations92
US6323127B1Nov 27, 2001
Capacitor formed with Pt electrodes having a 3D cup-like shape with roughened inner and outer surfaces
IBM21 citations92
US5998250ADec 7, 1999
Compound electrode stack capacitor
IBM43 citations92
US5932907AAug 3, 1999
Method, materials, and structures for noble metal electrode contacts to silicon
IBM19 citations92
US5914851AJun 22, 1999
Isolated sidewall capacitor
IBM28 citations92
US5701647ADec 30, 1997
Method for making an isolated sidewall capacitor having a compound plate electrode
IBM31 citations92
US6242321B1Jun 5, 2001
Structure and fabrication method for non-planar memory elements
IBM21 citations91
US6188120B1Feb 13, 2001
Method and materials for through-mask electroplating and selective base removal
IBM32 citations91
US5955759ASep 21, 1999
Reduced parasitic resistance and capacitance field effect transistor
IBM47 citations91
US5757612AMay 26, 1998
Structure and fabrication method for non-planar memory elements
IBM28 citations91
US6207584B1Mar 27, 2001
High dielectric constant material deposition to achieve high capacitance
IBM24 citations90
US8890261B2Nov 18, 2014
Fin field effect transistor devices with self-aligned source and drain regions
IBM7 citations84
US7285473B2Oct 23, 2007
Method for fabricating low-defect-density changed orientation Si
IBM11 citations81
US7745863B2Jun 29, 2010
Flip FERAM cell and method to form same
IBM5 citations74
US6870232B1Mar 22, 2005
Scalable MOS field effect transistor
IBM9 citations73
US6555859B2Apr 29, 2003
Flip FERAM cell and method to form same
IBM3 citations73
US6027966AFeb 22, 2000
Isolated sidewall capacitor
IBM14 citations73
US5712759AJan 27, 1998
Sidewall capacitor with L-shaped dielectric
IBM14 citations73
US6391773B2May 21, 2002
Method and materials for through-mask electroplating and selective base removal
IBM9 citations72
US7402857B2Jul 22, 2008
Flip FERAM cell and method to form same
IBM2 citations63
US7186573B2Mar 6, 2007
Flip FERAM cell and method to form same
IBM2 citations62
US6131258AOct 17, 2000
Sidewall capacitor with L-shaped dielectric
IBM5 citations62
US7217969B2May 15, 2007
Flip FERAM cell and method to form same
IBM0 citations52
INTERNAT BUSINESS MACHIENS COR
1 patentCHANG JOSEPHINE B
1 patentShowing the top 50 of 52 patents by PatentIndex Score.