P

Inventor

SAENGER KATHERINE LYNN

US52 patents
⚠️ This page may combine multiple inventors who share the name “SAENGER KATHERINE LYNN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

48 patents
US7923337B2Apr 12, 2011

Fin field effect transistor devices with self-aligned source and drain regions

IBM234 citations99
US7795677B2Sep 14, 2010

Nanowire field-effect transistors

IBM146 citations99
US6413852B1Jul 2, 2002

Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material

IBM264 citations99
US6140226AOct 31, 2000

Dual damascene processing for semiconductor chip interconnects

IBM363 citations99
US6448176B1Sep 10, 2002

Dual damascene processing for semiconductor chip interconnects

IBM102 citations98
US6265779B1Jul 24, 2001

Method and material for integration of fuorine-containing low-k dielectrics

IBM139 citations98
US6184121B1Feb 6, 2001

Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same

IBM369 citations98
US6096590AAug 1, 2000

Scalable MOS field effect transistor

IBM184 citations98
US5869880AFeb 9, 1999

Structure and fabrication method for stackable, air-gap-containing low epsilon dielectric layers

IBM108 citations98
US5789320AAug 4, 1998

Plating of noble metal electrodes for DRAM and FRAM

IBM326 citations98
US6815329B2Nov 9, 2004

Multilayer interconnect structure containing air gaps and method for making

IBM105 citations97
US6577011B1Jun 10, 2003

Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same

IBM86 citations97
US6346484B1Feb 12, 2002

Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structures

IBM80 citations97
US6172385B1Jan 9, 2001

Multilayer ferroelectric capacitor structure

IBM155 citations97
US6737725B2May 18, 2004

Multilevel interconnect structure containing air gaps and method for making

IBM70 citations96
US5825609AOct 20, 1998

Compound electrode stack capacitor

IBM58 citations96
US6740535B2May 25, 2004

Enhanced T-gate structure for modulation doped field effect transistors

IBM53 citations95
US6448655B1Sep 10, 2002

Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation

IBM50 citations95
US6030904AFeb 29, 2000

Stabilization of low-k carbon-based dielectrics

IBM53 citations93
US6017814AJan 25, 2000

Structure and fabrication method for stackable, air-gap-containing low epsilon dielectric layers

IBM21 citations93
US7098476B2Aug 29, 2006

Multilayer interconnect structure containing air gaps and method for making

IBM39 citations92
US6972440B2Dec 6, 2005

Enhanced T-gate structure for modulation doped field effect transistors

IBM19 citations92
US6759321B2Jul 6, 2004

Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation

IBM24 citations92
US6727174B1Apr 27, 2004

Method for fabricating a dual-diameter electrical conductor

IBM29 citations92
US6388285B1May 14, 2002

Feram cell with internal oxygen source and method of oxygen release

IBM30 citations92
US6333202B1Dec 25, 2001

Flip FERAM cell and method to form same

IBM27 citations92
US6323127B1Nov 27, 2001

Capacitor formed with Pt electrodes having a 3D cup-like shape with roughened inner and outer surfaces

IBM21 citations92
US5998250ADec 7, 1999

Compound electrode stack capacitor

IBM43 citations92
US5932907AAug 3, 1999

Method, materials, and structures for noble metal electrode contacts to silicon

IBM19 citations92
US5914851AJun 22, 1999

Isolated sidewall capacitor

IBM28 citations92
US5701647ADec 30, 1997

Method for making an isolated sidewall capacitor having a compound plate electrode

IBM31 citations92
US6242321B1Jun 5, 2001

Structure and fabrication method for non-planar memory elements

IBM21 citations91
US6188120B1Feb 13, 2001

Method and materials for through-mask electroplating and selective base removal

IBM32 citations91
US5955759ASep 21, 1999

Reduced parasitic resistance and capacitance field effect transistor

IBM47 citations91
US5757612AMay 26, 1998

Structure and fabrication method for non-planar memory elements

IBM28 citations91
US6207584B1Mar 27, 2001

High dielectric constant material deposition to achieve high capacitance

IBM24 citations90
US8890261B2Nov 18, 2014

Fin field effect transistor devices with self-aligned source and drain regions

IBM7 citations84
US7285473B2Oct 23, 2007

Method for fabricating low-defect-density changed orientation Si

IBM11 citations81
US7745863B2Jun 29, 2010

Flip FERAM cell and method to form same

IBM5 citations74
US6870232B1Mar 22, 2005

Scalable MOS field effect transistor

IBM9 citations73
US6555859B2Apr 29, 2003

Flip FERAM cell and method to form same

IBM3 citations73
US6027966AFeb 22, 2000

Isolated sidewall capacitor

IBM14 citations73
US5712759AJan 27, 1998

Sidewall capacitor with L-shaped dielectric

IBM14 citations73
US6391773B2May 21, 2002

Method and materials for through-mask electroplating and selective base removal

IBM9 citations72
US7402857B2Jul 22, 2008

Flip FERAM cell and method to form same

IBM2 citations63
US7186573B2Mar 6, 2007

Flip FERAM cell and method to form same

IBM2 citations62
US6131258AOct 17, 2000

Sidewall capacitor with L-shaped dielectric

IBM5 citations62
US7217969B2May 15, 2007

Flip FERAM cell and method to form same

IBM0 citations52

INTERNAT BUSINESS MACHIENS COR

1 patent

CHANG JOSEPHINE B

1 patent

Showing the top 50 of 52 patents by PatentIndex Score.