Inventor

METZLER DOMINIK

US27 patents

⚠️ This page may combine multiple inventors who share the name “METZLER DOMINIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

METZLER DOMINIK

IBM

Pillar-based memory hardmask smoothing and stress reduction

Lithographic photomask alignment using non-planar alignment structures formed on wafer

Lithographic alignment of a conductive line to a via

Via CD controllable top via structure

MRAM integration with BEOL interconnect including top via

Shallow and deep contacts with stitching

Top contact structures for stacked transistors

Subtractive patterning of interconnect structures

Placing top vias at line ends by selective growth of via mask from line cut dielectric

Pillar-based memory hardmask smoothing and stress reduction

Method for fabricating a semiconductor device including self-aligned top via formation at line ends

Placing top vias at line ends by selective growth of via mask from line cut dielectric

Self-aligned top via

Structurally stable self-aligned subtractive vias

Spin on scaffold film for forming topvia

Metal surface preparation for increased alignment contrast

Selective patterning of vias with hardmasks

Selective patterning of vias with hardmasks

Modified top electrode contact for MRAM embedding in advanced logic nodes

Embedded MRAM device with top via

Self-aligned top via formation at line ends

Self-aligned top vias over metal lines formed by a damascene process

Embedded MRAM device formation with self-aligned dielectric cap

Patterning integration scheme with trench alignment marks

LAM RES CORP

Polymerization protective liner for reactive ion etch in patterning

Multi-layer hardmask for defect reduction in EUV patterning

UNIV MARYLAND

Reactor for plasma-based atomic layer etching of materials