Inventor
YU ROY
US38 patents
Patents
38 patentsUS7354798B2Apr 8, 2008
Three-dimensional device fabrication method
IBM285 citations99
US6599778B2Jul 29, 2003
Chip and wafer integration process using vertical connections
IBM495 citations99
US6864165B1Mar 8, 2005
Method of fabricating integrated electronic chip with an interconnect device
IBM83 citations98
US6600224B1Jul 29, 2003
Thin film attachment to laminate using a dendritic interconnection
IBM83 citations98
US6036809AMar 14, 2000
Process for releasing a thin-film structure from a substrate
IBM112 citations98
US6856025B2Feb 15, 2005
Chip and wafer integration process using vertical connections
IBM35 citations96
US6835589B2Dec 28, 2004
Three-dimensional integrated CMOS-MEMS device and process for making the same
IBM48 citations96
US6444560B1Sep 3, 2002
Process for making fine pitch connections between devices and structure made by the process
IBM65 citations96
US6281452B1Aug 28, 2001
Multi-level thin-film electronic packaging structure and related method
IBM53 citations95
US6183588B1Feb 6, 2001
Process for transferring a thin-film structure to a substrate
IBM52 citations95
US7564118B2Jul 21, 2009
Chip and wafer integration process using vertical connections
IBM23 citations93
US7388277B2Jun 17, 2008
Chip and wafer integration process using vertical connections
IBM20 citations93
US7071031B2Jul 4, 2006
Three-dimensional integrated CMOS-MEMS device and process for making the same
IBM42 citations93
US7049697B2May 23, 2006
Process for making fine pitch connections between devices and structure made by the process
IBM22 citations93
US6737297B2May 18, 2004
Process for making fine pitch connections between devices and structure made by the process
IBM32 citations93
US6640021B2Oct 28, 2003
Fabrication of a hybrid integrated circuit device including an optoelectronic chip
IBM47 citations93
US5458520AOct 17, 1995
Method for producing planar field emission structure
IBM86 citations93
US6678949B2Jan 20, 2004
Process for forming a multi-level thin-film electronic packaging structure
IBM21 citations92
US6339527B1Jan 15, 2002
Thin film capacitor on ceramic
IBM41 citations92
US6143117ANov 7, 2000
Process for transferring a thin-film structure to a temporary carrier
IBM28 citations92
US6090633AJul 18, 2000
Multiple-plane pair thin-film structure and process of manufacture
IBM46 citations92
US6099935AAug 8, 2000
Apparatus for providing solder interconnections to semiconductor and electronic packaging devices
IBM24 citations91
US6998327B2Feb 14, 2006
Thin film transfer join process and multilevel thin film module
IBM27 citations88
US5735452AApr 7, 1998
Ball grid array by partitioned lamination process
IBM38 citations87
US6149048ANov 21, 2000
Apparatus and method for use in manufacturing semiconductor devices
IBM7 citations72
US6048741AApr 11, 2000
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
IBM6 citations71
US6323045B1Nov 27, 2001
Method and structure for top-to-bottom I/O nets repair in a thin film transfer and join process
IBM10 citations69
US6331731B1Dec 18, 2001
Column for module component
IBM9 citations66
US5722579AMar 3, 1998
Bottom-surface-metallurgy rework process in ceramic modules
IBM13 citations66
US6235412B1May 22, 2001
Corrosion-resistant terminal metal pads for thin film packages
IBM4 citations62
US6083375AJul 4, 2000
Process for producing corrosion-resistant terminal metal pads for thin film packages
IBM5 citations62
US6448169B1Sep 10, 2002
Apparatus and method for use in manufacturing semiconductor devices
IBM5 citations61
US6455331B2Sep 24, 2002
Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
IBM3 citations60
US6248599B1Jun 19, 2001
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
IBM2 citations60
US6054749AApr 25, 2000
Thin film device repaired using enhanced repair process
IBM2 citations60
US5972723AOct 26, 1999
Enhanced thin film wiring net repair process
IBM2 citations60
US5937269AAug 10, 1999
Graphics assisted manufacturing process for thin-film devices
IBM6 citations60
US11959874B2Apr 16, 2024
Nanostructure featuring nano-topography with optimized electrical and biochemical properties
IBM0 citations58