Inventor
KELLY KIMBERLEY A
US12 patents
Patents
12 patentsUS6036809AMar 14, 2000
Process for releasing a thin-film structure from a substrate
IBM112 citations98
US6281452B1Aug 28, 2001
Multi-level thin-film electronic packaging structure and related method
IBM53 citations95
US6183588B1Feb 6, 2001
Process for transferring a thin-film structure to a substrate
IBM52 citations95
US6678949B2Jan 20, 2004
Process for forming a multi-level thin-film electronic packaging structure
IBM21 citations92
US6143117ANov 7, 2000
Process for transferring a thin-film structure to a temporary carrier
IBM28 citations92
US6099935AAug 8, 2000
Apparatus for providing solder interconnections to semiconductor and electronic packaging devices
IBM24 citations91
US6632314B1Oct 14, 2003
Method of making a lamination and surface planarization for multilayer thin film interconnect
IBM14 citations82
US6149048ANov 21, 2000
Apparatus and method for use in manufacturing semiconductor devices
IBM7 citations72
US6048741AApr 11, 2000
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
IBM6 citations71
US6448169B1Sep 10, 2002
Apparatus and method for use in manufacturing semiconductor devices
IBM5 citations61
US6455331B2Sep 24, 2002
Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
IBM3 citations60
US6248599B1Jun 19, 2001
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
IBM2 citations60