Inventor
LEE YEELING L
US3 patents
Patents
3 patentsUS6048741AApr 11, 2000
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
IBM6 citations71
US6455331B2Sep 24, 2002
Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
IBM3 citations60
US6248599B1Jun 19, 2001
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices
IBM2 citations60