Inventor
WONG CONNIE M
US3 patents
Patents
3 patentsUS5536362AJul 16, 1996
Wire interconnect structures for connecting an integrated circuit to a substrate
FUJITSU LTD85 citations95
US6469394B1Oct 22, 2002
Conductive interconnect structures and methods for forming conductive interconnect structures
FUJITSU LTD63 citations94
US6543674B2Apr 8, 2003
Multilayer interconnection and method
FUJITSU LTD15 citations83