Inventor
DEV PRAKASH CHIMANLAL
US3 patents
Patents
3 patentsUS6649531B2Nov 18, 2003
Process for forming a damascene structure
IBM87 citations97
US6570256B2May 27, 2003
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
IBM85 citations96
US6740539B2May 25, 2004
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
IBM37 citations91