P

Inventor

CHU JACK O

US75 patents
⚠️ This page may combine multiple inventors who share the name “CHU JACK O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

42 patents
US6593625B2Jul 15, 2003

Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing

IBM182 citations98
US6855649B2Feb 15, 2005

Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing

IBM90 citations97
US6709903B2Mar 23, 2004

Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing

IBM86 citations97
US6805962B2Oct 19, 2004

Method of creating high-quality relaxed SiGe-on-insulator for strained Si CMOS applications

IBM52 citations96
US6649492B2Nov 18, 2003

Strained Si based layer made by UHV-CVD, and devices therein

IBM152 citations95
US5266504ANov 30, 1993

Low temperature emitter process for high performance bipolar devices

IBM53 citations95
US5245206ASep 14, 1993

Capacitors with roughened single crystal plates

IBM47 citations95
US7235812B2Jun 26, 2007

Method of creating defect free high Ge content (>25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques

IBM41 citations94
US7138697B2Nov 21, 2006

Structure for and method of fabricating a high-speed CMOS-compatible Ge-on-insulator photodetector

IBM54 citations94
US7705345B2Apr 27, 2010

High performance strained silicon FinFETs device and method for forming same

IBM52 citations93
US7217949B2May 15, 2007

Strained Si MOSFET on tensile-strained SiGe-on-insulator (SGOI)

IBM11 citations93
US6855963B1Feb 15, 2005

Ultra high-speed Si/SiGe modulation-doped field effect transistors on ultra thin SOI/SGOI substrate

IBM25 citations93
US8916451B2Dec 23, 2014

Thin film wafer transfer and structure for electronic devices

IBM29 citations92
US7999251B2Aug 16, 2011

Nanowire MOSFET with doped epitaxial contacts for source and drain

IBM22 citations92
US7902620B2Mar 8, 2011

Suspended germanium photodetector for silicon waveguide

IBM24 citations92
US7510904B2Mar 31, 2009

Structure for and method of fabricating a high-speed CMOS-compatible Ge-on-insulator photodetector

IBM22 citations92
US6875279B2Apr 5, 2005

Single reactor, multi-pressure chemical vapor deposition for semiconductor devices

IBM44 citations92
US6743651B2Jun 1, 2004

Method of forming a SiGe-on-insulator substrate using separation by implantation of oxygen

IBM30 citations92
US6690072B2Feb 10, 2004

Method and structure for ultra-low contact resistance CMOS formed by vertically self-aligned COSI2 on raised source drain Si/SiGe device

IBM16 citations92
US5259918ANov 9, 1993

Heteroepitaxial growth of germanium on silicon by UHV/CVD

IBM42 citations92
US10269714B2Apr 23, 2019

Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements

IBM4 citations84
US9431301B1Aug 30, 2016

Nanowire field effect transistor (FET) and method for fabricating the same

IBM11 citations84
US8861728B2Oct 14, 2014

Integrated circuit tamper detection and response

IBM12 citations84
US8828762B2Sep 9, 2014

Carbon nanostructure device fabrication utilizing protect layers

IBM10 citations84
US7393735B2Jul 1, 2008

Structure for and method of fabricating a high-mobility field-effect transistor

IBM10 citations84
US6972250B2Dec 6, 2005

Method and structure for ultra-low contact resistance CMOS formed by vertically self-aligned CoSi2 on raised source drain Si/SiGe device

IBM16 citations84
US5634973AJun 3, 1997

Low temperature selective growth of silicon or silicon alloys

IBM13 citations82
US7749847B2Jul 6, 2010

CMOS integration scheme employing a silicide electrode and a silicide-germanide alloy electrode

IBM7 citations74
US7429748B2Sep 30, 2008

High speed GE channel heterostructures for field effect devices

IBM8 citations74
US6949761B2Sep 27, 2005

Structure for and method of fabricating a high-mobility field-effect transistor

IBM7 citations74
US11101219B2Aug 24, 2021

Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements

IBM3 citations73
US10985105B2Apr 20, 2021

Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements

IBM3 citations73
US10957816B2Mar 23, 2021

Thin film wafer transfer and structure for electronic devices

IBM2 citations73
US9984940B1May 29, 2018

Selective and conformal passivation layer for 3D high-mobility channel devices

IBM6 citations73
US9887264B2Feb 6, 2018

Nanowire field effect transistor (FET) and method for fabricating the same

IBM3 citations73
US9768288B2Sep 19, 2017

Carbon nanostructure device fabrication utilizing protect layers

IBM2 citations73
US6780735B2Aug 24, 2004

Method to increase carbon and boron doping concentrations in Si and SiGe films

IBM7 citations73
US7704815B2Apr 27, 2010

Method of creating defect free high Ge content (>25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques

IBM5 citations72
US7445977B2Nov 4, 2008

Method of creating defect free high Ge content (> 25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques

IBM7 citations72
US7074686B2Jul 11, 2006

Method of creating high-quality relaxed SiGe-on-insulator for strained Si CMOS applications

IBM10 citations71
US5286334AFeb 15, 1994

Nonselective germanium deposition by UHV/CVD

IBM7 citations70
US7098057B2Aug 29, 2006

Ultra high-speed Si/SiGe modulation-doped field effect transistors on ultra thin SOI/SGOI substrate

IBM9 citations69

CHU JACK O

4 patents

ASSEFA SOLOMON

1 patent

BOL AGEETH A

1 patent

TYBERG CHRISTY S

1 patent

GLOBALFOUNDRIES INC

1 patent

Showing the top 50 of 75 patents by PatentIndex Score.