Inventor
CHU JACK O
US75 patents
⚠️ This page may combine multiple inventors who share the name “CHU JACK O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
42 patentsUS6593625B2Jul 15, 2003
Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing
IBM182 citations98
US6855649B2Feb 15, 2005
Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing
IBM90 citations97
US6709903B2Mar 23, 2004
Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing
IBM86 citations97
US6805962B2Oct 19, 2004
Method of creating high-quality relaxed SiGe-on-insulator for strained Si CMOS applications
IBM52 citations96
US6649492B2Nov 18, 2003
Strained Si based layer made by UHV-CVD, and devices therein
IBM152 citations95
US5266504ANov 30, 1993
Low temperature emitter process for high performance bipolar devices
IBM53 citations95
US5245206ASep 14, 1993
Capacitors with roughened single crystal plates
IBM47 citations95
US7235812B2Jun 26, 2007
Method of creating defect free high Ge content (>25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques
IBM41 citations94
US7138697B2Nov 21, 2006
Structure for and method of fabricating a high-speed CMOS-compatible Ge-on-insulator photodetector
IBM54 citations94
US7705345B2Apr 27, 2010
High performance strained silicon FinFETs device and method for forming same
IBM52 citations93
US7217949B2May 15, 2007
Strained Si MOSFET on tensile-strained SiGe-on-insulator (SGOI)
IBM11 citations93
US6855963B1Feb 15, 2005
Ultra high-speed Si/SiGe modulation-doped field effect transistors on ultra thin SOI/SGOI substrate
IBM25 citations93
US8916451B2Dec 23, 2014
Thin film wafer transfer and structure for electronic devices
IBM29 citations92
US7999251B2Aug 16, 2011
Nanowire MOSFET with doped epitaxial contacts for source and drain
IBM22 citations92
US7902620B2Mar 8, 2011
Suspended germanium photodetector for silicon waveguide
IBM24 citations92
US7510904B2Mar 31, 2009
Structure for and method of fabricating a high-speed CMOS-compatible Ge-on-insulator photodetector
IBM22 citations92
US6875279B2Apr 5, 2005
Single reactor, multi-pressure chemical vapor deposition for semiconductor devices
IBM44 citations92
US6743651B2Jun 1, 2004
Method of forming a SiGe-on-insulator substrate using separation by implantation of oxygen
IBM30 citations92
US6690072B2Feb 10, 2004
Method and structure for ultra-low contact resistance CMOS formed by vertically self-aligned COSI2 on raised source drain Si/SiGe device
IBM16 citations92
US5259918ANov 9, 1993
Heteroepitaxial growth of germanium on silicon by UHV/CVD
IBM42 citations92
US10269714B2Apr 23, 2019
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements
IBM4 citations84
US9431301B1Aug 30, 2016
Nanowire field effect transistor (FET) and method for fabricating the same
IBM11 citations84
US8861728B2Oct 14, 2014
Integrated circuit tamper detection and response
IBM12 citations84
US8828762B2Sep 9, 2014
Carbon nanostructure device fabrication utilizing protect layers
IBM10 citations84
US7393735B2Jul 1, 2008
Structure for and method of fabricating a high-mobility field-effect transistor
IBM10 citations84
US6972250B2Dec 6, 2005
Method and structure for ultra-low contact resistance CMOS formed by vertically self-aligned CoSi2 on raised source drain Si/SiGe device
IBM16 citations84
US5634973AJun 3, 1997
Low temperature selective growth of silicon or silicon alloys
IBM13 citations82
US7749847B2Jul 6, 2010
CMOS integration scheme employing a silicide electrode and a silicide-germanide alloy electrode
IBM7 citations74
US7429748B2Sep 30, 2008
High speed GE channel heterostructures for field effect devices
IBM8 citations74
US6949761B2Sep 27, 2005
Structure for and method of fabricating a high-mobility field-effect transistor
IBM7 citations74
US11101219B2Aug 24, 2021
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements
IBM3 citations73
US10985105B2Apr 20, 2021
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements
IBM3 citations73
US10957816B2Mar 23, 2021
Thin film wafer transfer and structure for electronic devices
IBM2 citations73
US9984940B1May 29, 2018
Selective and conformal passivation layer for 3D high-mobility channel devices
IBM6 citations73
US9887264B2Feb 6, 2018
Nanowire field effect transistor (FET) and method for fabricating the same
IBM3 citations73
US9768288B2Sep 19, 2017
Carbon nanostructure device fabrication utilizing protect layers
IBM2 citations73
US6780735B2Aug 24, 2004
Method to increase carbon and boron doping concentrations in Si and SiGe films
IBM7 citations73
US7704815B2Apr 27, 2010
Method of creating defect free high Ge content (>25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques
IBM5 citations72
US7445977B2Nov 4, 2008
Method of creating defect free high Ge content (> 25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques
IBM7 citations72
US7074686B2Jul 11, 2006
Method of creating high-quality relaxed SiGe-on-insulator for strained Si CMOS applications
IBM10 citations71
US5286334AFeb 15, 1994
Nonselective germanium deposition by UHV/CVD
IBM7 citations70
US7098057B2Aug 29, 2006
Ultra high-speed Si/SiGe modulation-doped field effect transistors on ultra thin SOI/SGOI substrate
IBM9 citations69
CHU JACK O
4 patentsUS8187955B2May 29, 2012
Graphene growth on a carbon-containing semiconductor layer
CHU JACK O10 citations84
US8877340B2Nov 4, 2014
Graphene growth on a non-hexagonal lattice
CHU JACK O12 citations83
US8541769B2Sep 24, 2013
Formation of a graphene layer on a large substrate
CHU JACK O10 citations83
US8405127B2Mar 26, 2013
Method and apparatus for fabricating a heterojunction bipolar transistor
CHU JACK O7 citations83
ASSEFA SOLOMON
1 patentBOL AGEETH A
1 patentTYBERG CHRISTY S
1 patentGLOBALFOUNDRIES INC
1 patentShowing the top 50 of 75 patents by PatentIndex Score.